
GF1A thru GF1M
Vishay Semiconductors
formerly General Semiconductor
Document Number 88617
08-Jul-02
www.vishay.com
1
Surface Mount Glass Passivated Rectifier
Patented*
Reverse Voltage
50 to 1000V
Forward Current
1.0A
DO-214BA (GF1)
Maximum Ratings & Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol
GF1A GF1B GF1D GF1G GF1J GF1K GF1M
Device marking code
Maximum repetitive peak reverse voltage
V
RRM
Maximum RMS voltage
V
RMS
Maximum DC blocking voltage
V
DC
Maximum average forward rectified current at T
L
= 125°C
I
F(AV)
Peak forward surge current 8.3ms single half sine-wave
I
FSM
superimposed on rated load (JEDEC Method)
Typical thermal resistance
(1)
R
Θ
JA
R
Θ
JL
Operating junction and storage temperature range
T
J
,T
STG
Unit
GA
50
35
50
GB
100
70
100
GD
200
140
200
GG
400
280
400
1.0
GJ
600
420
600
GK
800
560
800
GM
1000
700
1000
V
V
V
A
30
A
80
26
°C/W
–65 to +175
°C
Electrical Characteristics
(T
J
= 25°C unless otherwise noted)
Parameter
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Typical reverse recovery time at
I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25 A
Typical junction capacitance at 4.0V, 1MHz
Symbol
GF1A GF1B GF1D GF1G GF1J GF1K GF1M
V
F
Unit
V
1.10
5.0
50
1.20
T
A
= 25°C
T
A
= 125°C
I
R
μ
A
t
rr
3.0
μ
s
C
J
15
pF
Note:
(1) Thermal resistance from junction to ambient and from junction to lead, P.C.B. mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas
Features
Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
Ideal for surface mount automotive applications
High temperature metallurgically bonded construction
Cavity-free glass passivated junction
Capable of meeting environmental standards of
MIL-S-19500
Built-in strain relief Easy pick and place
High temperature soldering guaranteed:
450°C/5 seconds at terminals.
Complete device submersible temperature of 265°C for
10 seconds in solder bath
Mechanical Data
Case:
JEDEC DO-214BA, molded plastic over glass body
Terminals:
Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.0048 oz, 0.120 g
Dimensions in inches and (millimeters)
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602, brazen-lead assembly by Patent
No. 3,930,306 and lead forming by Patent No. 5,151,846
0.167 (4.24)
0.187 (4.75)
0.0065 (0.17)
0.015 (0.38)
0.030 (0.76)
0.060 (1.52)
0.196 (4.98)
0.226 (5.74)
0.094 (2.39)
0.114 (2.90)
0.100 (2.54)
0.118 (3.00)
0.040 (1.02)
0.066 (1.68)
0.098 (2.49)
0.108 (2.74)
0.006 (0.152) TYP.
0.094 MAX.
(2.38 MAX.)
0.220
(5.58) REF
0.066 MIN.
(1.68 MIN.)
0.052 MIN.
(1.32 MIN.)
Mounting Pad Layout