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參數(shù)資料
| 型號： | GM5BW97331A |
| 廠商： | Sharp Microelectronics |
| 文件頁數(shù)： | 8/18頁 |
| 文件大小： | 1051K |
| 描述： | LED WHITE 5000K 20MA 3.2V PLCC4 |
| 產(chǎn)品目錄繪圖： | LED PLCC-2 Side LED PLCC-2 Top 3-LED Schematic |
| 標準包裝： | 1 |
| 顏色： | 冷白色 |
| Millicandela 等級： | 7000mcd |
| 正向電壓： | 3.2V |
| 電流 - 測試： | 20mA |
| 波長 - 主： | 5000K |
| 視角： | 120° |
| 透鏡樣式/尺寸： | 圓形，帶平頂，2.4mm |
| 封裝/外殼： | 4-PLCC |
| 尺寸/尺寸： | 3.20mm L x 2.80mm W |
| 高度： | 1.90mm |
| 安裝類型： | 表面貼裝 |
| 包裝： | 標準包裝 |
| 產(chǎn)品目錄頁面： | 2920 (CN2011-ZH PDF) |
| 其它名稱： | 425-2741-6 |
8
Preliminary
GM5BW97331A
?SPAN class="pst GM5BW97331A_2663707_3">Reliability and Quality Information
Sharp tests to a Reliability Confidence Level of 90%. These tables illustrate the test criteria and conditions, along
with the Number of Samples, the Number of Defectives, and the Lot Tolerance Percent Defective.
?SPAN class="pst GM5BW97331A_2663707_3">Failure Judgement Criteria
*1 Measuring condition is in accordance with specification.
*2 U.S.L.: Upper Specification Limit.
*3 Solderability failure criterion: Fail if >90% solderability in plated test areas are not soldered.
Judgement areas are the bottom and sides as shown in Fig. 12.
No.
Test items
Test Conditions
Samples
(n)
Defective
(C)
LTPD
(%)
1 Temperature cycle
-40癈 (30 min) to +100癈 (30 min), 100 cycles 22
0
10
2 High temp and high humidity storage Tstg = +60癈, RH = 90%, t = 1000 hr
22
0
10
3 High temperature storage
Tstg = +100癈, t = 1000 hr
22
0
10
4 Low temperature storage
Tstg = -40癈, t = 1000 hr
22
0
10
5 Operating test
Tc = +40癈, I
F
= 25 mA/chip, t=1000 hr
22
0
10
6 Mechanical shock
15000 m/s
2
, 0.5 ms 盭 " 盰 " 盳 direction,
3 times (Tc = 25癈)
11
0
20
7 Variable frequency vibration
200 m/s
2
, 100 to 2000 to 100 Hz / sweep for
4 min. X " Y " Z direction, 4 times (Tc = 25癈)
11
0
20
8 Resistance to soldering temperatures Refer to the Soldering Profile; Performed twice 11
0
20
9 Solderability
Solder/flux M705/ESR250 (Senju Metal Indus-
try Co. Ltd.) Soldering temperature 245癈 ??
solder time 3 sec, 1 hr after Test 2 (above)
11
0
20
No.
Items
Symbol
Failure judgment criteria (*2)
1 Forward voltage
V
F
V
F
> U.S.L ?1.2
2 Reverse current
I
R
I
R
> U.S.L ?2.0
2 Luminous intensity (*3)
Iv
Iv < Initial value ?0.5, Iv > Initial value ?2.0
Fig. 12 Solderability Judgment Areas
Lead Bends
0.3
0.3
OTE: Units: mm
0.3
-
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