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參數資料
| 型號： | GM5BW97333A |
| 廠商： | Sharp Microelectronics |
| 文件頁數： | 14/15頁 |
| 文件大小： | 969K |
| 描述： | LED WHITE 11500K 20MA 3.2V PLCC4 |
| 產品目錄繪圖： | LED PLCC-2 Side LED PLCC-2 Top 3-LED Schematic |
| 標準包裝： | 1 |
| 顏色： | 冷白色 |
| Millicandela 等級： | 5100mcd |
| 正向電壓： | 3.2V |
| 電流 - 測試： | 20mA |
| 波長 - 主： | 11500K |
| 透鏡類型： | 散射，白色 |
| 透鏡樣式/尺寸： | 圓形，帶平頂，2.4mm |
| 封裝/外殼： | 4-PLCC |
| 尺寸/尺寸： | 3.20mm L x 2.80mm W |
| 高度： | 1.90mm |
| 安裝類型： | 表面貼裝 |
| 包裝： | 標準包裝 |
| 在特定電流下的光通量 - 測試： | 12 lm |
| 產品目錄頁面： | 2920 (CN2011-ZH PDF) |
| 其它名稱： | 425-2743-6 |
Sheet No.: DG-089015B
14
Preliminary
GM5BW9733xA (Series)
?SPAN class="pst GM5BW97333A_2656847_3">Recommended Solder Pad Design
1. Solderability depends on reflow conditions, solder paste, and circuit board materials. Check the entire process
before production commences.
2. Fig. 19 shows the recommended solder pad design for this part.
3. When using backside dip methods, Sharp recommends checking the process carefully: board warping from heat
can cause mechanical failure in these parts, in addition to the high heat conducted into the part through the
leads. Performing reflow after dip is recommended, with the interval between the two as short as possible.
?SPAN class="pst GM5BW97333A_2656847_3">Pick and Place Recommendations
1. Picking errors can occur based on the machines setup, so Sharp recommends verification with the machine in
actual use.
2. Do not allow the pick and place machine to contact the sealing resin in this part. If mechanical stress is placed
on the sealing resin, such forces can cause the resin to fail, or cause bonding wires within the part to break.
?SPAN class="pst GM5BW97333A_2656847_3">Presence of ODCs
This product shall not contain the following materials, and they are not used in the production process for this
product:
"Regulated substances: CFCs, Halon, Carbon tetrachloride, and 1,1,1-Trichloroethane (Methylchloroform).
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
"Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
Fig. 19 Recommended Solder Pad Design
1.5
OTE: Unit: mm
1.5
4.5
-
Center of Product
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相關代理商/技術參數 |
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| GM5BW9773A | 功能描述:標準LED-SMD White 5300K RoHS:否 制造商:Vishay Semiconductors 封裝 / 箱體:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明顏色:Red 波長/色溫:631 nm 透鏡顏色/類型:Water Clear 正向電流:30 mA 正向電壓:2 V 光強度:54 mcd 顯示角:130 deg 系列:VLMx1500 封裝:Reel |
| GM5EG95200A | 功能描述:標準LED-SMD 2.8 x 3.5 x 1.9 Chip LED Yelow-Green RoHS:否 制造商:Vishay Semiconductors 封裝 / 箱體:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明顏色:Red 波長/色溫:631 nm 透鏡顏色/類型:Water Clear 正向電流:30 mA 正向電壓:2 V 光強度:54 mcd 顯示角:130 deg 系列:VLMx1500 封裝:Reel |
| GM5GC01200AC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:HIGH-LUMINOSITY LED LAMP |
| GM5GC01250AC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:HIGH-LUMINOSITY LED LAMP |
| GM5GC03200Z | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:HIGH-LUMINOSITY LED LAMP |
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