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參數資料
型號: GM5BW97333A
廠商: Sharp Microelectronics
文件頁數: 14/15頁
文件大小: 969K
描述: LED WHITE 11500K 20MA 3.2V PLCC4
產品目錄繪圖: LED PLCC-2 Side
LED PLCC-2 Top
3-LED Schematic
標準包裝: 1
顏色: 冷白色
Millicandela 等級: 5100mcd
正向電壓: 3.2V
電流 - 測試: 20mA
波長 - 主: 11500K
透鏡類型: 散射,白色
透鏡樣式/尺寸: 圓形,帶平頂,2.4mm
封裝/外殼: 4-PLCC
尺寸/尺寸: 3.20mm L x 2.80mm W
高度: 1.90mm
安裝類型: 表面貼裝
包裝: 標準包裝
在特定電流下的光通量 - 測試: 12 lm
產品目錄頁面: 2920 (CN2011-ZH PDF)
其它名稱: 425-2743-6
 
Sheet No.: DG-089015B
14
Preliminary
GM5BW9733xA (Series)
?SPAN class="pst GM5BW97333A_2656847_3">Recommended Solder Pad Design
1. Solderability depends on reflow conditions, solder paste, and circuit board materials. Check the entire process
before production commences.
2. Fig. 19 shows the recommended solder pad design for this part.
3. When using backside dip methods, Sharp recommends checking the process carefully: board warping from heat
can cause mechanical failure in these parts, in addition to the high heat conducted into the part through the
leads. Performing reflow after dip is recommended, with the interval between the two as short as possible.
?SPAN class="pst GM5BW97333A_2656847_3">Pick and Place Recommendations
1. Picking errors can occur based on the machines setup, so Sharp recommends verification with the machine in
actual use.
2. Do not allow the pick and place machine to contact the sealing resin in this part. If mechanical stress is placed
on the sealing resin, such forces can cause the resin to fail, or cause bonding wires within the part to break.
?SPAN class="pst GM5BW97333A_2656847_3">Presence of ODCs
This product shall not contain the following materials, and they are not used in the production process for this
product:
"Regulated substances: CFCs, Halon, Carbon tetrachloride, and 1,1,1-Trichloroethane (Methylchloroform).
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
"Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
Fig. 19 Recommended Solder Pad Design
1.5
OTE:  Unit: mm
1.5
4.5
-
Center of Product
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