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參數資料
| 型號： | GM5ZR96270A |
| 廠商： | Sharp Microelectronics |
| 文件頁數： | 11/13頁 |
| 文件大小： | 621K |
| 描述： | LED RED 30MA 5V SMD |
| 產品目錄繪圖： | LED PLCC-2 Side LED PLCC-2 Top 1-LED Schematic |
| 標準包裝： | 1 |
| 顏色： | 紅 |
| Millicandela 等級： | 600mcd |
| 正向電壓： | 2.2V |
| 電流 - 測試： | 20mA |
| 波長 - 主： | 624nm |
| 視角： | 110° |
| 透鏡類型： | 透明 |
| 透鏡樣式/尺寸： | 圓形，帶平頂，2.4mm |
| 封裝/外殼： | 2-PLCC |
| 尺寸/尺寸： | 3.20mm L x 2.80mm W |
| 高度： | 1.90mm |
| 安裝類型： | 表面貼裝 |
| 包裝： | 標準包裝 |
| 產品目錄頁面： | 2920 (CN2011-ZH PDF) |
| 其它名稱： | 425-2729-6 |
Sheet No.: DG-072011
11
GM5ZR96270A
?SPAN class="pst GM5ZR96270A_2655836_2">Soldering Instructions
1. When soldering with reflow methods, Sharp recommends following the soldering profile in Fig. 13.
2. Electrodes on this part are silver-plated. If the part is exposed to a corrosive environment, the plating may be
damaged, thereby affecting solderability.
3. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
4. Both PCB design and solder reflow machine specifications will affect the amount of heat conducted into this part
during the production process. Sharp recommends verifying the process before production begins.
5. When using backside dip methods, Sharp recommends giving careful consideration to the process, as board
warping from heat may occur and the heat itself may be conducted into the package. Reflow after dip is recom-
mended, but they can be performed in the opposite order; keep the interval between the two processes as short
as possible.
6. When using a second reflow, the second process should be carried out as soon as possible after the first, unless
there is a water-wash or solvent-wash process. Then the parts must be baked as specified in Storage and Han-
dling before performing the second reflow.
7. The Reflow Profile shown in Fig. 13 should be considered as a set of maximum parameters. Since this part uses
the leads for heatsinking, the peak temperature should be kept as cool as possible and the cooldown period
lengthened as much as possible. Thermal conduction into the LED will be affected by the performance of the
reflow process, so verification of the reflow process is recommended. These parts may be used in a nitrogen
reflow process.
Fig. 13 Temperature Profile
25
150
1 ~ 4癈/s
1 ~ 4癈/s
1 ~ 2.5癈/s
220
260 (MAX)
200
60 ~ 120s
5s (MAX)
60s (MAX)
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