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參數(shù)資料
| 型號(hào)： | GP2W1002YP0F |
| 廠商： | Sharp Microelectronics |
| 文件頁數(shù)： | 3/14頁 |
| 文件大小： | 373K |
| 描述： | IRDA MODULE 1152KBPS 8SMD |
| 標(biāo)準(zhǔn)包裝： | 2,000 |
| 系列： | * |
| 數(shù)據(jù)速率： | 1.152Mbs（MIR） |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 無效電流，標(biāo)準(zhǔn)值@ 25° C： | 0.01µA |
| 通信距離，低功率： | 20cm，1m |
| 方向： | 側(cè)視圖 |
| 工作溫度： | -25°C ~ 85°C |
| 尺寸： | 8mm x 3mm x 2.5mm |
| 標(biāo)準(zhǔn)： | IrPHY 1.4 |
| 關(guān)機(jī)： | * |
| 包裝： | 帶卷 (TR) |
GP2W1002YP0F
?SPAN class="pst GP2W1002YP0F_2589044_0">Recommended PCB Foot Pattern
(Unit : mm)
Terminal
Symbol
`
LED Anode
LEDA
a
LED Cathode
LEDC
b
Transmitter Data Input TXD
c
Receiver Data Output RXD
d
Shutdown
SD
e
V
CC
V
CC
f
Logic I/O levels
V
IO
g
Ground
GND
h
Shield Ground
SGND
: Solder paste area
1.35
0.6
0.475
1.425
3.325
Mounting center
(unit : mm)
?SPAN class="pst GP2W1002YP0F_2589044_0">Recommended Size of Solder Creamed Paste (Reference)
g f e d c b a `
1.75
1.25
1.35
0.6
1.425
0.475
3.325
2.05
0.1
?/DIV>
Mounting center
g f e d
c b
a `
1.02
Dimensions are shown for reference.
Please open the solder mask as below
so that the size of solder creamed paste
for this device before reflow soldering
must be as large as one of the foot
pattern land indicated for reference.
Sheet No.: E3-A00201EN
3
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