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參數(shù)資料
| 型號(hào)： | GS816118D-225I |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| 中文描述： | 165焊球BGA封裝？x18 Commom的I / O？頂視圖（D組） |
| 文件頁(yè)數(shù)： | 1/40頁(yè) |
| 文件大小： | 1391K |
| 代理商： | GS816118D-225I |
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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision: 9/26/02
GS816118/32/36D
Supplemental Datasheet Information
This supplemental information applies to the GS816118/36T datasheet, which you will
find attached to this document. This supplement includes a new package offering (the
165-bump BGA—Package D), as well as an additional organization (x32, which is only
offered in the 165 BGA for this part).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GS816118D-250 | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-250I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816132D-133 | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816132D-133I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816132D-150 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Right Angle Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS816118D-250 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-250I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118DD-150 | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
| GS816118DD-150I | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
| GS816118DD-150IV | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
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