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參數資料
型號: GS816136D-150
廠商: Electronic Theatre Controls, Inc.
英文描述: PCB Header; No. of Contacts:72; Pitch Spacing:0.1"; No. of Rows:2; Series:929; Body Material:Glass-Filled Polyester; Contact Material:Copper Alloy; Contact Plating:Tin; Leaded Process Compatible:Yes RoHS Compliant: Yes
中文描述: 165焊球BGA封裝?x18 Commom的I / O?頂視圖(D組)
文件頁數: 1/40頁
文件大小: 1391K
代理商: GS816136D-150
1/8
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision: 9/26/02
GS816118/32/36D
Supplemental Datasheet Information
This supplemental information applies to the GS816118/36T datasheet, which you will
find attached to this document. This supplement includes a new package offering (the
165-bump BGA—Package D), as well as an additional organization (x32, which is only
offered in the 165 BGA for this part).
相關PDF資料
PDF描述
GS816136D-150I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166I 2 ROW 4PIN 30U GOLD
GS816136D-200 2 ROW, 4PIN, 30 U GOLD
GS816136D-200I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
相關代理商/技術參數
參數描述
GS816136D-150I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-200 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-200I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
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