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參數資料
| 型號： | GS88218BD-333I |
| 廠商： | GSI TECHNOLOGY |
| 元件分類： | DRAM |
| 英文描述： | 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs |
| 中文描述： | 512K X 18 CACHE SRAM, 4.5 ns, PBGA165 |
| 封裝： | 13 X 15 MM, 1 MM PITCH, FPBGA-165 |
| 文件頁數： | 36/37頁 |
| 文件大小： | 751K |
| 代理商： | GS88218BD-333I |
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GS88218/36BB/D-333/300/250/200/150
Rev: 1.02 10/2004
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
36/37
2002, GSI Technology
256K x 36
GS88236BD-333
Pipeline/Flow Through
165 BGA (var. 1)
333/4.5
C
256K x 36
GS88236BD-300
Pipeline/Flow Through
165 BGA (var. 1)
300/5
C
256K x 36
GS88236BD-250
Pipeline/Flow Through
165 BGA (var. 1)
250/5.5
C
256K x 36
GS88236BD-200
Pipeline/Flow Through
165 BGA (var. 1)
200/6.5
C
256K x 36
GS88236BD-150
Pipeline/Flow Through
165 BGA (var. 1)
150/7.5
C
512K x 18
GS88218BD-333I
Pipeline/Flow Through
165 BGA (var. 1)
333/4.5
I
512K x 18
GS88218BD-300I
Pipeline/Flow Through
165 BGA (var. 1)
300/5
I
512K x 18
GS88218BD-250I
Pipeline/Flow Through
165 BGA (var. 1)
250/5.5
I
512K x 18
GS88218BD-200I
Pipeline/Flow Through
165 BGA (var. 1)
200/6.5
I
512K x 18
GS88218BD-150I
Pipeline/Flow Through
165 BGA (var. 1)
150/7.5
I
256K x 36
GS88236BD-333I
Pipeline/Flow Through
165 BGA (var. 1)
333/4.5
I
256K x 36
GS88236BD-300I
Pipeline/Flow Through
165 BGA (var. 1)
300/5
I
256K x 36
GS88236BD-250I
Pipeline/Flow Through
165 BGA (var. 1)
250/5.5
I
256K x 36
GS88236BD-200I
Pipeline/Flow Through
165 BGA (var. 1)
200/6.5
I
256K x 36
GS88236BD-150I
Pipeline/Flow Through
165 BGA (var. 1)
150/7.5
I
Ordering Information for GSI Synchronous Burst RAMs (Continued)
Org
Part Number
1
Type
Package
Speed
2
(MHz/ns)
T
A3
Status
Notes:
1.
2.
Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS88236B-150IT.
The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
T
A
= C = Commercial Temperature Range. T
A
= I = Industrial Temperature Range.
GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings
3.
4.
相關PDF資料 |
PDF描述 |
|---|---|
| GS88236BB-150 | 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs |
| GS88236BB-150I | 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs |
| GS88236BB-200 | 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs |
| GS88236BB-200I | 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs |
| GS88236BB-250 | 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs |
相關代理商/技術參數 |
參數描述 |
|---|---|
| GS88218CB-200 | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays |
| GS88218CB-200I | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays |
| GS88218CB-200IV | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V/2.5V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays |
| GS88218CB-200V | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 1.8V/2.5V 9MBIT 512KX18 6.5NS/3NS 119FPBGA - Trays |
| GS88218CB-250 | 制造商:GSI Technology 功能描述:SRAM SYNC DUAL 2.5V/3.3V 9MBIT 512KX18 5.5NS/2.5NS 119FPBGA - Trays |
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