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參數資料
| 型號： | HBU606 |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | 3 A, 600 V, SILICON, BRIDGE RECTIFIER DIODE |
| 文件頁數： | 1/2頁 |
| 文件大?。?/td> | 68K |
| 代理商： | HBU606 |
FEATURES
Data Sheet No. BRHB-600-1C
MECHANICAL SPECIFICATION
E27
Case: Molded plastic, U/L Flammability Rating 94V-0
Terminals: Round silver plated copper pins/faston connectors
Soldering: Per MIL-STD 202 Method 208 guaranteed
Polarity: Marked on case
Mounting Position: Any.
Weight: 0.13 Ounces (3.6 Grams)
MECHANICAL DATA
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratingsat25°Cambienttemperature unlessotherwisespecified.
Single phase, half wave,60Hz, resistive or inductive load.
Average Forward Rectified Current
Peak Forward Surge Current. Single 60Hz Half-Sine Wave
Superimposed on Rated Load (JEDEC Method). T = 150 C
O
Junction Operating and Storage Temperature Range
T
J
, T
STG
I
O
°C
-55 to +150
Continuous Power Dissipation in V
@ T
=80 C (Heat Sink Temp)
HS
Region
(BR)
o
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Working Peak Reverse Voltage
Series Number
V
RWM
V
RRM
V
R (RMS)
V
RM
SYMBOL
AHBU AHBUAHBU HBU HBU
604
606
608
HBU
602
HBU
604
HBU
606
HBU HBU
608
AMPS
UNITS
VOLTS
P
RM
P
R
600
601
610
1000
400
600
800
50
100
200
400
600
800
RMS Reverse Voltage
400
n/a
n/a
280
420
560
35
70
140
280
420
700
560
Power Dissipation in V
Region for 100 S Square Wave
(BR)
CONTROLLED
AVALANCHE
NON-CONTROLLED
AVALANCHE
2
WATTS
Thermal Energy (Rating for Fusing)
I t
2
127
AMPS
SEC
2
I
FSM
250
@ T = 50 C
@ T = 40 C
A
o
o
6
3
Typical Thermal Resistance (on Heat Sink)
R
θ
JA
R
θ
JC
V
FM
Maximum Forward Voltage (Per Diode) at 6 Amps DC
VOLTS
VOLTS
n/a
n/a
Minimum Avalanche Voltage
Maximum Avalanche Voltage
V
(BR) Min
V
(BR) Max
Maximum Reverse Current at Rated V
RM
@ T = 25 C
A
@T = 100 C
A
o
o
I
RM
Minimum Insulation Breakdown Voltage (Circuit to Case)
V
ISO
Junction to Ambient
Junction to Case
450
650
850
900 1100 1300
0.95 (Typical < 0.90)
5
1
μ
A
mA
2000
o
C/W
16.0
5.7
3.01 06hbu
RATINGS
DIMENSIONS SHOWN IN
INCHES (MILLIMETERS)
φ
0.04 (1.02)
0.90 (22.86)
EPOXY FILLED
CAVITY
0.11
(2.79)
0.04 (1.02)
0.43 Max
(10.9)
0.250 +/- 0.010
(6.35 +/- 0.254)
0.69
(17.53)
+
-
TFAC
0.25
(6.35)
0.50
(12.7)
0.50
(12.7)
0.50
(12.7)
+
_
UL RECOGNIZED - FILE #E141956
DC LEADS
AC LEADS
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
18020 Hobart Blvd., Unit B
Gardena, CA 90248
U.S.A
ABHB-600-1C
BUILT-IN STRESS RELIEF MECHANISM FOR
SUPERIOR RELIABILITY AND PERFORMANCE
Unique structure
Ideal for DC motor related applications
- DC leads on one side, AC leads on
the opposite side
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
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