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參數資料
| 型號： | HC5503CBZ |
| 廠商： | INTERSIL CORP |
| 元件分類： | 模擬傳輸電路 |
| 英文描述： | Low Cost 24V SLIC For PABX / Key Systems |
| 中文描述： | TELECOM-SLIC, PDSO24 |
| 封裝： | GREEN, PLASTIC, MS-013AD, SOIC-24 |
| 文件頁數： | 17/17頁 |
| 文件大小： | 386K |
| 代理商： | HC5503CBZ |
17
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
HC5503
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
μ
α
0.25(0.010)
B
M
M
M24.3
(JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.020
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.5985
0.6141
15.20
15.60
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
24
24
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
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PDF描述 |
|---|---|
| HC5503CBZ96 | Low Cost 24V SLIC For PABX / Key Systems |
| HC5503CCP | Bipolar Transistor; Collector Emitter Voltage, Vceo:50V; Transistor Polarity:NPN; Power Dissipation:900mW; DC Current Gain Min (hfe):180; Collector Current:500A; Package/Case:3-TO-92 |
| HC5503CCB | Unbalanced PBX/Key System SLIC, Subscriber Line Interface Circuit |
| HC5503TCB | Bipolar Transistor; Collector Emitter Voltage, Vceo:50V; Transistor Polarity:NPN; Power Dissipation:900mW; DC Current Gain Min (hfe):180; Collector Current:500A; Package/Case:3-TO-92 |
| HC5503TCP | Bipolar Transistor; Collector Emitter Voltage, Vceo:50V; Transistor Polarity:PNP; Power Dissipation:900mW; DC Current Gain Min (hfe):180; Collector Current:500A; Package/Case:3-TO-92 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| HC5503CBZ96 | 功能描述:電信線路管理 IC HC5503CBEL RoHS:否 制造商:STMicroelectronics 產品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| HC5503CCB | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HC5503CCP | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HC5503CM | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HC5503CM96 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Subscriber Line Interface Circuit |
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