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參數資料
| 型號： | HF42A060SCE |
| 英文描述： | Fixed attenuators (with SMA connectors); HRS No: 354-0097-9 40; Connector Type: Adapter; Impedance (ohm): 50; Frequency Range (GHz): 0 to 18; Power Capacity (W): 1; Attenuation (Max): 12; Contact Mating Area Plating: Gold; Operating Temperature Range (degrees C): -10 to 65; General Description: With SMA-Plug/Jack connector |
| 文件頁數： | 1/1頁 |
| 文件大小： | 16K |
| 代理商： | HF42A060SCE |
HF42A040SCE
Preliminary Data Sheet PD-20611 12/98
Hexfred Die in Wafer Form
400 V
Size 42
5" Wafer
Nominal Back Metal Composition, Thickness
Nominal Front Metal Composition, Thickness
Chip Dimensions
Wafer Diameter
Wafer Thickness
Relevant Die Mechanical Dwg. Number
Minimum Street Width
Reject Ink Dot Size
Recommended Storage Environment
Cr-Ni-Ag ( 1kA-4kA-6kA )
Ti-Ni-Ag ( 2kA-1kA-35kA )
0.1988" x 0.1988"
125mm, with std. < 100 > flat
.015" ± .003"
01-5313
100 Microns
0.25mm Diameter Minimum
Store in original container, in dessicated
nitrogen, with no contamination
Mechanical Data
Die Outline
Reference Standard IR packaged part ( for design ) : HFA120MD40C
Parameter
V
FM
BV
R
I
RM
Description
Guaranteed (Min/Max)
1.2V Max.
400V Min.
6μA Max.
Test Conditions
Forward Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
T
J
= 25°C, I
F
= 60A
T
J
= 25°C, I
R
= 200μA
T
J
= 25°C, V
R
= 400V
Electrical Characteristics ( Wafer Form )
NOTES :
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES )
2. CONTROLLING DIMENSION : ( INCH )
3. DIMENSIONAL TOLERANCES :
BONDING PADS : < 0.635 TOLERANCE = ± 0.013
WIDTH
< (.0250) TOLERANCE = ± (.0005)
&
> 0.635 TOLERANCE = ± 0.025
LENGTH
> (.0250) TOLERANCE = ± (.0010)
OVERALLDIE
< 1.270 TOLRANCE = ± 0.102
WIDTH
< (.050) TOLERANCE = ± (.004)
&
> 1.270 TOLERANCE = ± 0.203
LENGTH
> (.050) TOLERANCE = ± (.008)
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