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參數資料
| 型號： | HGTP14N37G3VL |
| 廠商： | INTERSIL CORP |
| 元件分類： | 功率晶體管 |
| 英文描述： | 14A, 370V N-Channel, Logic Level, Voltage Clamping IGBTs(14A, 370V N溝道,邏輯電平,電壓箝位IGBTs) |
| 中文描述： | 25 A, N-CHANNEL IGBT, TO-220AB |
| 文件頁數： | 8/8頁 |
| 文件大?。?/td> | 128K |
| 代理商： | HGTP14N37G3VL |
8
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil Ltd.
8F-2, 96, Sec. 1, Chien-kuo North,
Taipei, Taiwan 104
Republic of China
TEL: 886-2-2515-8508
FAX: 886-2-2515-8369
HGT1S14N37G3VLS, HGTP14N37G3VL
TO-220AB
3 LEAD JEDEC TO-220AB PLASTIC PACKAGE
LEAD
Lead No. 1
Lead No. 2
Lead No. 3
Term. No. 4
Mounting Flange
TERMINAL
Gate
Collector
Emitter
Collector
E
P
Q
D
H
1
E
1
L
L
1
60
o
b
1
b
1
2
e
3
e
1
A
c
J
1
45
o
D
1
A
1
TERM. 4
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.170
0.180
4.32
4.57
-
A
1
b
0.048
0.052
1.22
1.32
-
0.030
0.034
0.77
0.86
3, 4
b
1
c
0.045
0.055
1.15
1.39
2, 3
0.014
0.019
0.36
0.48
2, 3, 4
D
0.590
0.610
14.99
15.49
-
D
1
E
-
0.160
-
4.06
-
0.395
0.410
10.04
10.41
-
E
1
e
-
0.030
-
0.76
-
0.100 TYP
2.54 TYP
5
e
1
H
1
J
1
L
0.200 BSC
5.08 BSC
5
0.235
0.255
5.97
6.47
-
0.100
0.110
2.54
2.79
6
0.530
0.550
13.47
13.97
-
L
1
P
0.130
0.150
3.31
3.81
2
0.149
0.153
3.79
3.88
-
Q
0.102
0.112
2.60
2.84
-
NOTES:
1. These dimensions are within allowable dimensions of Rev. J of
JEDEC TO-220AB outline dated 3-24-87.
2. Lead dimension and finish uncontrolled in L
1
.
3. Lead dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder coating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 2 dated 7-97.
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