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參數資料
| 型號： | HIP5062DY |
| 廠商： | INTERSIL CORP |
| 元件分類： | 穩壓器 |
| 英文描述： | FPGA 1000000 SYSTEM GATE 1.8 VOLT - NOT RECOMMENDED for NEW DESIGN |
| 中文描述： | 10 A DUAL SWITCHING CONTROLLER, 1100 kHz SWITCHING FREQ-MAX, UUC40 |
| 封裝： | DIE-40 |
| 文件頁數： | 1/7頁 |
| 文件大小： | 655K |
| 代理商： | HIP5062DY |
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2002. All Rights Reserved
HIP5062
Power Control IC Single Chip Dual Switch-
ing Power Supply
The HIP5062 is a complete power control IC, incorporating
two high power DMOS transistors, CMOS logic and two low
level analog control circuits on the same Intelligent Power
IC. Both the standard “Boost” and the “SEPIC” (Single-
Ended Primary Inductance Converter) power supply
topologies are easily implemented with this single control IC.
Special power transistor current sensing circuitry is
incorporated that minimizes losses due to the monitoring
circuitry. Moreover, over-temperature and over-voltage
detection circuitry is incorporated within the IC to monitor the
chip temperature and the actual power supply output
voltage. These circuits can disable the drive to the power
transistor to protect both the transistor and, most
importantly, the load from over-voltage.
As a result of the power DMOS transistor’s current and
voltage capability (5A and 60V), multiple output power
supplies with total output power capability up to 100W are
possible.
Features
Two Current Mode Control Regulators
Two 60V, 5A On-chip DMOS Transistors
Thermal Protection
Over-Voltage Protection
Over-Current Protection
1MHz Operation or External Clock
Synchronization Output
On-Chip Reference Voltage - 5.1V
Output Rise and Fall Times ~ 3ns
Designed for 26V to 42V Operation
Applications
Single Chip Power Supplies
Current Mode PWM Applications
Distributed Power Supplies
Multiple Output Converters
Chip
Ordering Information
PART NUMBER
TEMPERATURE
RANGE
PACKAGE
HIP5062DY
0
o
C to +85
o
C
40 Pad Chip
HIP5062DW
0
o
C to +85
o
C
Wafer
175 mils x 175 mils (4.44mm x 4.44mm)
V+ (40)
TMON (39)
IRFI2 (38)
IRFO2 (37)
VINP (36)
AGND (35)
DGND (34)
XCKS (33)
CKIN (32)
IRFI1 (31)
IRFO1 (30)
VCMP1 (29)
VTCN (28)
(8) V
DDP2
(9) VCMP2
(10) PSOK
(11) VREG2
(12) FLTN
(13) PSEN
(14) SHRT
(15) SLRN
(16) SFST
(17) V
DDD
(18) V
DDA
(19) VREG1
(20) V
DDP1
(
(
(
(
(
(
(
S
D
D
S
D
S
August 1998
File Number
3208.2
NoOBSOLETE PRODUCT
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