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參數(shù)資料
| 型號： | HMU16GC-35 |
| 廠商： | HARRIS SEMICONDUCTOR |
| 元件分類： | 數(shù)字信號處理外設(shè) |
| 英文描述： | 16 x 16-Bit CMOS Parallel Multipliers |
| 中文描述： | 16-BIT, DSP-MULTIPLIER, CPGA68 |
| 文件頁數(shù)： | 12/13頁 |
| 文件大?。?/td> | 225K |
| 代理商： | HMU16GC-35 |
12
HMU16, HMU17
Ceramic Pin Grid Array Packages (CPGA)
INDEX CORNER
SEE NOTE 9
E1
E
–B–
–A–
S
D1
C
S
S1
b
b1
–C–
A
e
0.008 C
B
B
A
SEE
NOTE 7
A
L
A1
Q
C
0.010
C
A
0.030
B
b
L
A1
Q
k
SEATING PLANE
AT STANDOFF
D
M
M
M
M
SECTION B-B
b2
SECTION A-A
G68.B
MIL-STD-1835 CMGA3-P68D (P-AC)
68 LEAD CERAMIC PIN GRID ARRAY PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.215
0.345
5.46
8.76
-
A1
0.070
0.145
1.78
3.68
3
b
0.016
0.0215
0.41
0.55
8
b1
0.016
0.020
0.41
0.51
-
b2
0.042
0.058
1.07
1.47
4
C
-
0.080
-
2.03
-
D
1.140
1.180
28.96
29.97
-
D1
1.000 BSC
25.4 BSC
-
E
1.140
1.180
28.96
29.97
-
E1
1.000 BSC
25.4 BSC
-
e
0.100 BSC
2.54 BSC
6
k
0.008 REF
0.20 REF
-
L
0.120
0.140
3.05
3.56
-
Q1
0.025
0.060
0.64
1.52
5
S
0.000 BSC
0.00 BSC
10
S1
0.003
-
0.08
-
-
M
11
11
1
N
-
121
-
121
2
Rev. 0 6/20/95
NOTES:
1. “M” represents the maximum pin matrix size.
2. “N” represents the maximum allowable number of pins. Number
of pins and location of pins within the matrix is shown on the
pinout listing in this data sheet.
3. Dimension “A1” includes the package body and Lid for both cav-
ity-up and cavity-down configurations. This package is cavity
down. Dimension “A1” does not include heatsinks or other
attached features.
4. Standoffs are required and shall be located on the pin matrix di-
agonals. The seating plane is defined by the standoffs at dimen-
sion “Q1”.
5. Dimension “Q1” applies to cavity-down configurations only.
6. All pins shall be on the 0.100 inch grid.
7. Datum C is the plane of pin to package interface for both cavity
up and down configurations.
8. Pin diameterincludessolder dip or customfinishes. Pin tips shall
have a radius or chamfer.
9. Corner shape (chamfer, notch, radius, etc.) may vary from that
shown on the drawing. The index corner shall be clearly unique.
10. Dimension “S” is measured with respect to datums A and B.
11. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
12. Controlling dimension: INCH.
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