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參數(shù)資料
型號(hào): HPND-4018
英文描述: Beam Lead PIN Diodes for Phased Arrays and Switches (71K in pdf)
中文描述: 束相控陣和PIN二極管開(kāi)關(guān)無(wú)鉛(71K線PDF格式)
文件頁(yè)數(shù): 1/2頁(yè)
文件大小: 38K
代理商: HPND-4018
2-93
Small Signal RF PIN Diode Chips
for Hybrid Integrated Circuits
Technical Data
Features
Thermocompression/
Thermosonically Bondable
Ideal for Hybrid Integrated
Circuits
Gold Metallization
Silicon Nitride Passivation
Uniform Electrical
Characteristics
Batch Matched Versions
Available
Planar Construction
HPND-0001
HPND-0002
Outline 01B
Chip Dimensions
D
X
Y
X
DIMENSIONS
D
X
Y
TOP CONTACT
BOTTOM
CONTACT
DIMENSIONS IN MILLIMETERS (1/1000 INCH).
FOR EPOXY OR EUTECTIC
DIE ATTACH
PART NO. HPND-
-0001
0.25
(10)
0.51
(20)
0.15
(6)
CATHODE
ANODE
-0002
0.20
(8)
0.38
(15)
0.15
(6)
CATHODE
ANODE
(0.03) (1)
(0.05) (2)
(0.03) (1)
Description
These PIN/NIP diode chips are
specifically designed for hybrid
applications requiring thermo-
sonic or thermocompression
bonding techniques. The top
metallization is a layer of gold for
a tarnish free surface that allows
either thermosonic or
thermocompression bonding
techniques. The bottom metalli-
zation is also gold, suitable for
epoxy or eutectic die attach
method.
Applications
These small signal, general
purpose PIN/NIP diode chips are
optimized for various analog and
digital applications such as
switches, digital phase shifters,
pulse and amplitude modulators,
limiters, leveling, and attenuating.
5965-9143E
相關(guān)PDF資料
PDF描述
HPND-4028 Beam Lead PIN Diodes for Phased Arrays and Switches (71K in pdf)
HPND-4038 Beam lead Diodes for switching applications
HPVA-0180 Microwave/Millimeter Wave Amplifier
HPW7095 6-Channel DC/DC Converter Control IC
HPW7095A 6-Channel DC/DC Converter Control IC
相關(guān)代理商/技術(shù)參數(shù)
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