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參數(shù)資料
| 型號(hào)： | HSCCS-CALBL-001 |
| 廠商： | Nuventix |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 0K |
| 描述： | HEATSINK 40W CHIP 30 AL BLACK |
| 產(chǎn)品培訓(xùn)模塊： | Synjet® Coolers for Use in LED Lighting |
| 標(biāo)準(zhǔn)包裝： | 100 |
| 系列： | SynJet® |
| 類型： | 插件板級(jí) |
| 冷卻式包裝： | 分類（BGA，LGA，CPU，ASIC……） |
| 固定方法： | 把緊螺栓 |
| 形狀： | 方形 |
| 長度： | 1.969"（50.00mm） |
| 寬： | 1.969"（50.00mm） |
| 機(jī)座外的高度（散熱片高度）： | 1.173"（29.80mm） |
| 材質(zhì)： | 鋁 |
| 配用： | 1061-1002-ND - SYNJET XFLOW 30 HIGH PWM 12V 1061-1000-ND - SYNJET XFLOW 30 HIGH PWM 5V |
| 其它名稱： | 1061-1004 |
PRODUCT DATASHEET
4635 Boston Lane
Phone: 512-382-8100
MKTG-DOC-00116
A01
Austin, TX 78735
www.nuventix.com
Revision
Oct 2011
SynJet
XFlow 30 High Performance Cooler
SynJet cooling technology provides the most reliable thermal
management solution available. This cooler has been developed
by Nuventix as a general purpose cooling solution for ICs such as
FPGAs, microprocessors, and ASICs as well as LED cooling.
Cools up to 40 W
4
Reliable 100K Hours Lifetime
Energy Efficient
Specifications
Thermal & Acoustic
SynJet Setting
Θs-a
TDP
SPL (dBA)
(W)
Wire Connections
High Performance
1.1
40
38
Red to +VDC
Black to Ground
PWM at 100% duty cycle
Red to +VDC
Black to Ground
Blue to PWM Signal
Electrical
SynJet Setting
2
Voltage
(VDC)
+/- 10%
Current (mA)
Pavg
(W)
Voltage
(VDC)
+/- 10%
Current (mA)
6
Pavg
(W)
Imin
Iavg
Ipeak
Imin
Iavg
Ipeak
High Performance
5
20
240
480
1.2
12
10
117
234
1.4
PWM at 100% duty cycle
Environmental
All Settings
Min
Max
Units
Conditions
Operating Temperature
-40
75
°C
Air temperature surrounding cooler
Storage Temperature
-50
95
°C
Air temperature surrounding cooler
Storage Altitude
15K
m
Above sea level
Operating Relative Humidity
5
95
%
Non-condensing
Weight
61
g
SynJet only with heat sink
Reliability
100K
hrs
L10 @ 60
°C
Regulatory Compliance
RoHS, UL, FCC Part 15 Class B, CE
1 All values are typical at 25C unless otherwise stated.
2 The Level Select model should be used for discrete performance settings. Follow the instructions in the Product Design Guide for adjusting settings.
3 Thermal resistance values are given as reference only and are measured in free air without airflow obstructions. Thermal resistance is measured from the bottom
middle of the heat sink to ambient air measured at the inlet to the SynJet, with a heat source at least 15cm
2 using the reference heat sink. Actual thermal
performance may vary by application and final product design should be tested to assure proper thermal performance.
4 Thermal Design Power is based on a 44C temperature rise of heat sink mounting surface above ambient temperature around cooler.
5 Sound Pressure Level is measured at 1 meter distance per ISO 7779.
6 The SynJet has a time varying current. The current waveform is sinusoidal and the average current (Iavg) is used to calculate the average power consumption
(Pavg) at nominal input voltage (VDC). See the Electrical section in the Product Design Guide for a detailed explanation.
5 yr Warranty
Small Form Factor
75
°C Operating ambient
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSCCS-CALCL-001 | 功能描述:LOW PROFILE CHIP COOLER HEATSINK RoHS:是 類別:風(fēng)扇，熱管理 >> 熱敏 - 散熱器 系列:SynJet® 產(chǎn)品目錄繪圖:BDN12-3CB^A01 標(biāo)準(zhǔn)包裝:300 系列:BDN 類型:頂部安裝 冷卻式包裝:分類（BGA，LGA，CPU，ASIC……） 固定方法:散熱帶，粘合劑（含） 形狀:方形，鰭片 長度:1.21"（30.73mm） 寬:1.210"（30.73mm） 直徑:- 機(jī)座外的高度（散熱片高度）:0.355"（9.02mm） 溫升時(shí)的功耗:- 在強(qiáng)制氣流下的熱敏電阻:在 400 LFM 時(shí)為6.8°C/W 自然環(huán)境下的熱電阻:19.6°C/W 材質(zhì):鋁 材料表面處理:黑色陽極化處理 產(chǎn)品目錄頁面:2681 (CN2011-ZH PDF) 其它名稱:294-1099 |
| HSCCS-CALCL-002 | 制造商:Nuventix 功能描述: |
| HSCD | 制造商:ALPS 制造商全稱:ALPS ELECTRIC CO.,LTD. 功能描述:Geomagnetic Sensor |
| HSC-D | 功能描述:光纖連接器 FO CONN SPLIT SLEEVE RoHS:否 制造商:Molex 產(chǎn)品:Adapters 類型:8 Port with External Shutter 連接器類型:Adapter 模式:Multimode 光纖直徑: 顏色:Blue 附件類型:LC Adapter |
| HSC-D(01) | 功能描述:光纖連接器 FO CONN SPLIT SLEEVE RoHS:否 制造商:Molex 產(chǎn)品:Adapters 類型:8 Port with External Shutter 連接器類型:Adapter 模式:Multimode 光纖直徑: 顏色:Blue 附件類型:LC Adapter |
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