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參數資料
| 型號： | HSDL-3002 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Data Compliant Low Power 115.2 kbit/s with Remote Control Transmission Infrared Transceiver |
| 中文描述： | 紅外線㈢數據兼容低功耗115.2 kbit / s的傳輸與紅外遙控收發器 |
| 文件頁數： | 11/20頁 |
| 文件大小： | 451K |
| 代理商： | HSDL-3002 |
11
Process Zone
Symbol
T
Maximum DT/Dtime
Heat Up
P1, R1
25
°
C to 125
°
C
125
°
C to 170
°
C
170
°
C to 230
°
C (245
°
C at 10 seconds max.)
230
°
C to 170
°
C
170
°
C to 25
°
C
4
°
C/s
0.5
°
C/s
4
°
C/s
–4
°
C/s
–3
°
C/s
Solder Paste Dry
P2, R2
Solder Reflow
P3, R3
P3, R4
Cool Down
P4, R5
The reflow profile is a straight-
line representation of a nominal
temperature profile for a
convective reflow solder process.
The temperature profile is divided
into four process zones, each
with different
T/
time tempera-
ture change rates. The
T/
time
rates are detailed in the above
table. The temperatures are
measured at the component to
printed circuit board connections.
In
process zone P1
, the PC
board and HSDL-3602 castella-
tion I/O pins are heated to a
temperature of 125
°
C to activate
the flux in the solder paste. The
temperature ramp up rate, R1, is
limited to 4
°
C per second to allow
for even heating of both the PC
board and HSDL-3602
castellation I/O pins.
Process zone P2
should be of
sufficient time duration (>60
seconds) to dry the solder paste.
The temperature is raised to a
level just below the liquidus point
of the solder, usually 170
°
C
(338
°
F).
Process zone P3
is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 230
°
C (446
°
F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 90 seconds, the intermetallic
growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170
°
C (338
°
F), to allow
the solder within the connections
to freeze solid.
Process zone P4
is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25
°
C (77
°
F) should not exceed
-3
°
C per second maximum. This
limitation is necessary to allow
the PC board and HSDL-3602
castellation I/O pins to change
dimensions evenly, putting
minimal stresses on the HSDL-
3602 transceiver.
Reflow Profile
Figure 15. Reflow graph.
0
t-TIME (SECONDS)
T
–
–
°
C
200
183
170
150
125
100
50
50
150
100
200
250
300
230
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL
DOWN
25
R1
R2
R3
R4
R5
90 sec.
MAX.
ABOVE
183
°
C
MAX. 245
°
C
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相關代理商/技術參數 |
參數描述 |
|---|---|
| HSDL-3002-007 | 功能描述:紅外收發器 50cm 3V SIR+RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續數據傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3002-007 | 制造商:Avago Technologies 功能描述:TRANSCEIVER SMD IRDA 115.2KB |
| HSDL-3003 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:IrDA㈢ Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver |
| HSDL-3003-001 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:IrDA㈢ Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver |
| HSDL-3003-021 | 功能描述:紅外收發器 20 CM 3V SIR PLUS RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續數據傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
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