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參數資料
| 型號： | HSDL-3005-021 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver |
| 中文描述： | 紅外線㈢數據兼容低功耗115.2 kbit / s的紅外遙控器 |
| 文件頁數： | 16/22頁 |
| 文件大?。?/td> | 548K |
| 代理商： | HSDL-3005-021 |
16
Appendix B:
PCB Layout Suggestion
The following PCB layout
guidelines should be followed to
obtain a good PSRR and EM
immunity resulting in good
electrical performance. Things to
note:
1. The ground plane should be
continuous under the part,
but should not extend under
the shield trace.
2. The shield trace is a wide, low
inductance trace back to the
system ground.
3. VLED can be connected to
either unfiltered or
unregulated power supply. If
VLED and Vcc share the same
power supply, CX3 need not
be used and the connections
for CX1 and CX2 should be
before the current limiting
resistor R1. In a noisy
environment, including
capacitor CX2 can enhance
supply rejection. CX1 is
generally a ceramic capacitor
of low inductance providing a
wide frequency response
while CX2 and CX3 are
tantalum capacitors of big
volume and fast frequency
response. The use of a
tantalum capacitor is more
critical on the VLED line,
which carries a high current.
4. Preferably a multi-layered
board should be used to
provide sufficient ground
plane. Use the layer
underneath and near the
transceiver module as Vcc,
and sandwich that layer
between ground connected
board layers. Refer to the
diagram below for an example
of a four-layer board.
The area underneath the module
at the second layer, and 3 cm in
all directions around the
module, is defined as the critical
ground plane zone. The ground
plane should be maximized in
Top View
this zone. Refer to application
note AN1114 or the Avago IrDA
Data Link Design Guide for
details. The layout below is
based on a two-layer PCB.
Bottom View
TOP LAYER
CONNECT THE METAL SHIELD AND MODULE
GROUND PIN TO BOTTOM GROUND LAYER.
LAYER 2
CRITICAL GROUND PLANE ZONE. DO NOT
CONNECT DIRECTLY TO THE MODULE
GROUND PIN.
LAYER 3
KEEP DATA BUS AWAY FROM CRITICAL
GROUND PLANE ZONE.
BOTTOM LAYER (GND)
相關PDF資料 |
PDF描述 |
|---|---|
| HSDL-3005-028 | IrDA㈢ Data Compliant Low Power 115.2 kbit/s with Remote Control Infrared Transceiver |
| HSDL-3020 | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver |
| HSDL-3020-021 | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver |
| HSDL-3021 | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver |
| HSDL-3021-021 | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver |
相關代理商/技術參數 |
參數描述 |
|---|---|
| HSDL-3005-028 | 功能描述:紅外收發器 20cm 3V SIR plus R C Top View RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續數據傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3020 | 制造商:Avago Technologies 功能描述:TRANSCEIVER IRDA 4MB/S |
| HSDL-3020-021 | 功能描述:紅外收發器 Orion 2 FIR + RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續數據傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3021 | 制造商:Avago Technologies 功能描述:TRANSCEIVER IRDA 4MB/S |
| HSDL-3021-021 | 功能描述:紅外收發器 FIR + RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續數據傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
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