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參數(shù)資料
| 型號： | HSDL-3020 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver |
| 中文描述： | 紅外線㈢數(shù)據(jù)兼容低功耗4.0 Mbit / s的紅外遙控器 |
| 文件頁數(shù)： | 15/24頁 |
| 文件大小： | 212K |
| 代理商： | HSDL-3020 |
15
Appendix B: PCB Layout Suggestion
The effects of EMI and power
supply noise can potentially
reduce the sensitivity of the
receiver, resulting in reduced link
distance. The PCB layout played
an important role to obtain a good
PSRR and EM immunity resulting
in good electrical performance.
Things to note:
1. The ground plane should be
continuous under the part, but
should not extend under the
shield trace.
2. The shield trace is a wide, low
inductance trace back to the
system ground. CX1, CX2,
CX3, CX4, CX5, CX6 and CX7
are optional supply filter
capacitors; they may be left
out if a clean power supply is
used.
3. IR and RC VLED can be
connected to either unfiltered
or unregulated power supply.
The bypass capacitors should
be connection before the
current limiting resistor R3
and R4 respectively. In a noisy
environment, including
capacitor CX2 and CX7 can
enhance supply rejection. CX6
and CX3 that are generally a
ceramic capacitor of low
inductance providing a wide
frequency response while CX2
and CX4 are tantalum
capacitor of big volume and
fast frequency response. The
use of a tantalum capacitor is
more critical on the VLED line,
which carries a high current.
4. V
CC
pin can be connected to
either unfiltered or
unregulated power supply.
The Resistor, R1 together with
the capacitors, CX1 and CX2
acts as the low pass filter.
5. IOV
CC
is connected to the
ASIC voltage supply or the V
CC
supply. The capacitor, CX5
acts as the bypass capacitor.
6. Preferably a multi-layered
board should be used to
provide sufficient ground
plane. Use the layer
underneath and near the
Top Layer:
Connect the
metal shield and module
ground pin to bottom
ground layer;
Place the bypass capacitors
within 0.5cm from the V
CC
and ground pin of the
module.
Layer 2:
Critical ground
plane zone. 3 cm in all
direction around the
module. Connect to a
clean, noiseless ground
node (eg bottom layer).
Layer 3:
Keep data bus
away from critical ground
plane zone.
Bottom layer:
Ground
layer. Ground noise
<75 mVp-p. Should be
separated from ground
used by noisy sources.
transceiver module as V
CC
,
and sandwich that layer
between ground connected
board layers. The diagram
below demonstrate an
example of a 4 layer board:
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSDL-3020-021 | 功能描述:紅外收發(fā)器 Orion 2 FIR + RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3021 | 制造商:Avago Technologies 功能描述:TRANSCEIVER IRDA 4MB/S |
| HSDL-3021-021 | 功能描述:紅外收發(fā)器 FIR + RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3200 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:IrDA 1.2 Data Compliant 115.2Kb/s 3V Infrared Transceiver |
| HSDL-3200#021 | 功能描述:紅外收發(fā)器 IR Transceiver 115.2Kb/s RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
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