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參數(shù)資料
| 型號： | HSDL-3021 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver |
| 中文描述： | 紅外線㈢數(shù)據(jù)兼容低功耗4.0 Mbit / s的紅外遙控器 |
| 文件頁數(shù)： | 15/26頁 |
| 文件大?。?/td> | 205K |
| 代理商： | HSDL-3021 |
15
Appendix B: PCB Layout Suggestion
The effects of EMI and power
supply noise can potentially
reduce the sensitivity of the
receiver, resulting in reduced
link distance. The PCB layout
played an important role to
obtain a good PSRR and EM
immunity resulting in good
electrical performance. Things to
note:
1. The ground plane should be
continuous under the part,
but should not extend under
the shield trace.
2. The shield trace is a wide,
low inductance trace back to
the system ground. CX1, CX2,
CX3, CX4 and CX5 are
optional supply filter
capacitors; they may be left
out if a clean power supply is
used.
3. VLED can be connected to
either unfiltered or
unregulated power supply.
The bypass capacitors should
be connection before the
current limiting resistor R2
respectively. In a noisy
environment, including
capacitor CX3and CX4 can
enhance supply rejection.
CX3 that is generally a
ceramic capacitor of low
inductance providing a wide
frequency response while
CX4 is tantalum capacitor of
big volume and fast
frequency response. The use
of a tantalum capacitor is
more critical on the VLED
line, which carries a high
current.
4. V
CC
pin can be connected to
either unfiltered or
unregulated power supply.
The Resistor, R1 together
with the capacitors, CX1 and
CX2 acts as the low pass
filter.
5. IOV
CC
is connected to the
ASIC voltage supply or the
VCC supply. The capacitor,
CX5 acts as the bypass
capacitor.
6. Preferably a multi-layered
board should be used to
provide sufficient ground
plane. Use the layer
underneath and near the
Top Layer:
Connect the
metal shield and module
ground pin to bottom
ground layer;
Place the bypass capacitors
within 0.5 cm from the V
CC
and ground pin of the
module.
Layer 2:
Critical ground
plane zone. 3 cm in all
directions around the
module. Connect to a
clean, noiseless ground
node (e.g., bottom layer).
Layer 3:
Keep data bus
away from critical ground
plane zone.
Bottom layer:
Ground
layer. Ground noise
<75 mVp-p. Should be
separated from ground
used by noisy sources.
transceiver module as Vcc,
and sandwich that layer
between ground connected
board layers. The diagram
below demonstrate an
example of a 4 layer board:
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相關代理商/技術參數(shù) |
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|---|---|
| HSDL-3021-021 | 功能描述:紅外收發(fā)器 FIR + RC RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3200 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:IrDA 1.2 Data Compliant 115.2Kb/s 3V Infrared Transceiver |
| HSDL-3200#021 | 功能描述:紅外收發(fā)器 IR Transceiver 115.2Kb/s RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續(xù)數(shù)據(jù)傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3200-921 | 制造商:Lite-On Semiconductor Corporation 功能描述:IRDA TX/RX 0.1152MBPS 2.7V TO 3.6V 8PIN - Tape and Reel |
| HSDL-3201 | 制造商:LITEON 制造商全稱:Lite-On Technology Corporation 功能描述:IrDA? Data 1.4 Low Power Compliant 115.2 kb/s Infrared Transceiver |
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