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參數資料
| 型號： | HSDL-3220 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s Infrared Transceiver |
| 中文描述： | 紅外線㈢數據兼容低功耗4.0 Mbit / s的紅外收發器 |
| 文件頁數： | 13/19頁 |
| 文件大小： | 190K |
| 代理商： | HSDL-3220 |
13
Appendix B: PCB Layout Suggestion
The following PCB layout guide-
lines should be followed to obtain
a good PSRR and EM immunity
resulting in good electrical
performance. Things to note:
1. The ground plane should be
continuous under the part, but
should not extend under the
shield trace.
2. The shield trace is a wide, low
inductance trace back to the
system ground. CX1, CX2,
CX3, and CX4 are optional
supply filter capacitors; they
may be left out if a clean
power supply is used.
3. Vled can be connected to
either unfiltered or unregu-
lated power supply. If Vled
and Vcc share the same power
supply, CX3 need not be used
and the connections for CX1
and CX2 should be before the
current limiting resistor R1. In
a noisy environment, including
capacitor CX2 can enhance
supply rejection. CX1 is
generally a ceramic capacitor
of low inductance providing a
wide frequency response while
CX2 and CX3 are tantalum
capacitors of big volume and
fast frequency response. The
use of a tantalum capacitor is
more critical on the Vled line,
which carries a high current.
CX4 is an optional ceramic
capacitor, similar to CX1, for
the IOVcc line.
Figure 16. PCB layout suggestion.
TOP LAYER
CONNECT THE METAL SHIELD AND MODULE
GROUND PIN TO BOTTOM GROUND LAYER.
LAYER 2
CRITICAL GROUND PLANE ZONE. DO NOT
CONNECT DIRECTLY TO THE MODULE
GROUND PIN.
LAYER 3
KEEP DATA BUS AWAY FROM CRITICAL
GROUND PLANE ZONE.
BOTTOM LAYER (GND)
The area underneath the module
at the second layer, and 3 cm in
all directions around the module
is defined as the critical ground
plane zone. The ground plane
should be maximized in this
4. Preferably a multi-layered
board should be used to
provide sufficient ground
plane. Use the layer under-
neath and near the transceiver
zone. Refer to application note
AN1114 or the Agilent IrDA Data
Link Design Guide for details.
The layout below is based on a
2-layer PCB.
module as Vcc, and sandwich
that layer between ground
connected board layers.
Refer to the diagram below for
an example of a 4 layer board.
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PDF描述 |
|---|---|
| HSDL-3220-001 | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s Infrared Transceiver |
| HSDL-3220-021 | IrDA㈢ Data Compliant Low Power 4.0 Mbit/s Infrared Transceiver |
| HSDL-3602 | IrDA㈢ Data 1.4 Compliant 4 Mb/s 3V Infrared Transceiver |
| HSDL-3602-008 | IrDA㈢ Data 1.4 Compliant 4 Mb/s 3V Infrared Transceiver |
| HSDL-3602-038 | IrDA㈢ Data 1.4 Compliant 4 Mb/s 3V Infrared Transceiver |
相關代理商/技術參數 |
參數描述 |
|---|---|
| HSDL-3220-001 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:IrDA㈢ Data Compliant Low Power 4.0 Mbit/s Infrared Transceiver |
| HSDL-3220-021 | 功能描述:紅外收發器 20-30cm 3V FIR RoHS:否 制造商:Vishay Semiconductors 波長:900 nm 連續數據傳輸:115.2 Kbit/s 傳輸距離:1 m 輻射強度:60 mW/sr 半強度角度:44 deg 脈沖寬度:2 us 最大上升時間:100 ns 最大下降時間:100 ns LED 電源電壓:- 0.5 V to 6 V 最大正向電流:80 mA 工作電壓:2.4 V to 5.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 尺寸:6 mm x 3.1 mm x 1.9 mm 封裝 / 箱體: 封裝:Reel |
| HSDL-3310 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:IrDA 1.3 Data Compliant 1.15Mb/s 3-5V Infrared Transceiver |
| HSDL-3310#007 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Telecomm/Datacomm |
| HSDL-3310#017 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Telecomm/Datacomm |
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