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參數資料
| 型號： | HSDL-7002 |
| 廠商： | Avago Technologies Ltd. |
| 英文描述： | 3/16 Encode/Decode Integrated Circuit in QFN Package |
| 中文描述： | 3 / 16編碼/解碼電路集成采用QFN封裝 |
| 文件頁數： | 7/11頁 |
| 文件大小： | 243K |
| 代理商： | HSDL-7002 |
7
Recommended Storage Conditions
HSDL-7002 Moisture Proof Packaging
All HSDL-7002 options are shipped in moisture proof pack-
age. Once opened, moisture absorption begins.
This part is compliant to JEDEC MSL (Moisture Sensetive
Level ) 3.
Baking Conditions
If the parts are not stored in dry conditions, they must be
baked before reflow to prevent damage to the parts.
Package
In reels
In bulk
Temp
60 °C
100 °C
125 °C
150 °C
Time
≥
48hours
≥
4hours
≥
2 hours
≥
1 hour
Time from unsealing to soldering
After removal from the bag, the parts should be soldered
within three days if stored at the recommended storage
conditions. If times longer than three days are needed,
the parts must be stored in a dry box.
Storage Temperature 10°C to 30°C
Relative Humidity
below 60% RH
Baking should only be done once.
Figure 4. Baking Conditions Chart
Environment
less than 25 deg C,
and less than
60% RH
Yes
No
No
Yes
Perform
Recommended
Baking
Conditions
Package Is
Opened
(Unsealed)
Units in A
Sealed
Moisture-Proof
Package
No
Baking Is
Necessary
Package Is
Opened for less
than 168
hours
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