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參數資料
| 型號： | HSDL-9100-001 |
| 廠商： | Avago Technologies Ltd. |
| 元件分類： | 速度傳感器和接近開關 |
| 英文描述： | Surface-Mount Proximity Sensor |
| 中文描述： | 表面貼裝接近傳感器 |
| 文件頁數： | 9/12頁 |
| 文件大小： | 318K |
| 代理商： | HSDL-9100-001 |
Recommended Reflow Profile
The reflow profile is a straight-line representation of a
nominal temperature profile for a convective reflow sol-
der process. The temperature profile is divided into four
process zones, each with different DT/Dtime temperature
change rates. The DT/Dtime rates are detailed in the above
table. The temperatures are measured at the component
to printed circuit board connections.
In process zone P1, the PC board and HSDL-9100 castella-
tion pins are heated to a temperature of 160°C to activate
the flux in the solder paste. The temperature ramp up rate,
R1, is limited to 4°C per second to allow for even heating
of both the PC board and HSDL-9100 castellations.
Process zone P2 should be of sufficient time duration (60
to 120 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder,
usually 200°C (392°F).
0
100
10
00
0
00
t-TIME
(SECONDS)
0
10
10
10
00
0
0
0
T
R1
R
R
R
R
MAX 0C
0 sec
MAX
Above 0 C
P1
HEAT
UP
P
SOLDER PASTE DRY
P
SOLDER
REFLOW
P
COOL DOWN
Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point of
solder to 255°C (491°F) for optimum results. The dwell time
above the liquidus point of solder should be between 20
and 60 seconds. It usually takes about 20 seconds to as-
sure proper coalescing of the solder balls into liquid solder
and the formation of good solder connections. Beyond a
dwell time of 60 seconds, the intermetallic growth within
the solder connections becomes excessive, resulting in
the formation of weak and unreliable connections. The
temperature is then rapidly reduced to a point below the
solidus temperature of the solder, usually 200°C (392°F), to
allow the solder within the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The
cool down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum.
This limitation is necessary to allow the PC board and HSDL-
9100 castellations to change dimensions evenly, putting
minimal stresses on the HSDL-9100 transceiver.
PROCESS ZONE
Symbol
D
T
Maximum
D
T/
D
time
Heat Up
P1, R1
25°C to 160°C
4°C/s
Solder Paste Dry
P2, R2
160°C to 200°C
0.5°C/s
Solder Reflow
P3, R3P3, R4
200°C to 255°C (260°C at 10 seconds max)
255°C to 200°C
4°C/s
-6°C/s
Cool Down
P4, R5
200°C to 25°C
-6°C/s
Figure 8. Reflow graph
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相關代理商/技術參數 |
參數描述 |
|---|---|
| HSDL-9100-021 | 功能描述:板機接口移動感應器和位置傳感器 Proximity Sensor RoHS:否 制造商:Panasonic Electric Works 封裝 / 箱體:TO-5 感應距離:3 m 輸出類型:Digital 電源電壓-最大:6 V 電源電壓-最小:2.3 V 電源電流: 最大工作溫度:+ 60 C 封裝:Bulk |
| HSDL-9100-024 | 功能描述:近程傳感器 Proximity Sensor RoHS:否 制造商:Vishay Semiconductors 感應方式:Optical 感應距離:1 mm to 200 mm 電源電壓:2.5 V to 3.6 V 安裝風格:SMD/SMT 輸出配置:Digital 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 系列:VCNL3020 |
| HSDL9-12-285 | 功能描述:KIT HEAT SHRINK/LABEL 0.90X0.25" RoHS:否 類別:線纜，導線 - 管理 >> 標簽，標記 系列:PAN-CODE™ 標準包裝:250 系列:CM-SCE 標簽類型:標準 標簽尺寸:2.00" x 0.25"（50.8mm x 6.4mm） 顏色:白 材質:聚烯烴 適用于相關產品:點陣打印機 包裝:* 工作溫度:-55°C ~ 135°C 其它名稱:A105291CM-SCE-TP-1/4-4H-9 |
| HSDL9-12-94 | 制造商:Panduit Corp 功能描述: |
| HSDL9-25-94 | 功能描述:KIT HEAT SHRINK/LABEL 0.90X0.25" RoHS:否 類別:線纜，導線 - 管理 >> 標簽，標記 系列:PAN-CODE™ 標準包裝:250 系列:CM-SCE 標簽類型:標準 標簽尺寸:2.00" x 0.25"（50.8mm x 6.4mm） 顏色:白 材質:聚烯烴 適用于相關產品:點陣打印機 包裝:* 工作溫度:-55°C ~ 135°C 其它名稱:A105291CM-SCE-TP-1/4-4H-9 |
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