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參數(shù)資料
| 型號： | HSDL-9100-021 |
| 廠商： | Avago Technologies Ltd. |
| 元件分類： | 速度傳感器和接近開關(guān) |
| 英文描述： | Surface-Mount Proximity Sensor |
| 中文描述： | 表面貼裝接近傳感器 |
| 文件頁數(shù)： | 10/12頁 |
| 文件大小： | 318K |
| 代理商： | HSDL-9100-021 |
10
Figure 11. Solder stencil aperture
Figure 12. Keep-out area
Adjacent Land Keep out and Solder Mask Areas
Adjacent land keep out is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area. The minimum
solder resist strip width required to avoid solder bridg-
ing adjacent pads is 0.2mm.It is recommended that two
fiducial crosses be placed at mid length of the pads for
unit alignment. Also do take note that there should not
be any electrical routing with the component placement
compartment.
Note:
Wet/Liquid Photo-imaginable solder resist/mask is recommended
Recommended Metal solder Stencil Aperture
It is recommended that only a 0.152 mm (0.006 inch) or a
0.127 mm (0.005 inch) thick stencil be used for solder paste
printing. This is to ensure adequate printed solder paste
volume and no shorting. See Table 1 below the drawing for
combinations of metal stencil aperture and metal stencil
thickness that should be used. Aperture opening for shield
pad is 3.05 mm x 1.1 mm as per land pattern.
Table 1. Combinations of metal stencil aperture and
metal stencil thickness
Dim.
mm
h
.1
l
11
k
.
j
.
Recommended land pattern
Figure 10. Recommended land pattern
Solder Pad, Mask and Metal Stencil
Appendix A:
HSDL-9100 SMT Assembly Application Note
Stencil
thickness,
t (mm)
Aperture size (mm)
Length,
l
Width,
w
0.1
1.0+/-0.0
0.+/-0.0
0.1
1.
0.+/-0.0
PCBA
Land Pattern
Solder Mask
Metal stencil for
solder paste printing
Stencil Aperture
Mounting Center
1.
.
0.
1.
0.
Component
placement
.
FIDUCIAL
FIDUCIAL
l
w
t
Apertures as per
Land Dimensions
Mounting Center
j
h
Component placement
Solder Mask
k
l
Figure 9. Stencil and PCBA
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