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參數(shù)資料
型號: HSMB-HR00-R1T20
英文描述: High-Flux Surface Mount LED(高流量表貼型LED芯片)
中文描述: 高通量表面貼裝發(fā)光二極管(高流量表貼型的LED芯片)
文件頁數(shù): 1/8頁
文件大小: 144K
代理商: HSMB-HR00-R1T20
High-Flux Surface Mount LED
Technical Data
Features
High-Flux Device
Improved Reliability
Through Elimination of
Internal Wire Bond
-55
°
C to 110
°
C Operating
Temperature Range
Compatible with IR and
Through-the-Wave Solder
Processes
Available in 8 mm Tape on
178 mm (7”) Reels
Applications
Telltale Backlighting in
Instrument Clusters
LCD Backlighting
General Status Indicators
Description
The HSMB-HX00 device is
designed for applications
requiring high-flux in surface
mount designs. The product is
ideal for telltale backlighting in
automotive instrument clusters,
LCD backlighting, or general
status indication. The high light
output lowers the cost of lighting
by reducing the number of LEDs
required for any application.
The HSMB-HX00 combines high
reliability surface mount flip-chip
LED construction with the
world’s brightest red and amber
LED materials, HP’s TS AlInGaP
material.
HSMB-HR00-R1T20
HSMB-HA00-R1T2H
Device Selection Guide
Part Number
Color
Luminous Intensity Luminous Intensity
I
V
(mcd)
@ I
F
= 20 mA
Min.
100
100
Viewing
Angle
(2
θ
, Degrees)
1
/
2
Typical Dominant
Wavelength
(nm)
Red 630
Amber 590
I
V
(mcd)
@ I
F
= 20 mA
Typ.
160
200
HSMB-HR00-R1T20
HSMB-HA00-R1T2H
120
120
Notes:
1. The dominant wavelength,
λ
d
, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
4.
θ
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1
/
2
The package is compatible with
IR and convective reflow
soldering processes. These parts
are also compatible with
through-the-wave soldering
processes.
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