
Pad Description
Pad No.
Pad Name
I/O
Internal
Connection
Description
1
AS9
I/O
Pull-High
CMOS
Input:
Output: Address output for DRAM of 1Mb and
column address strobe for DRAM of 256K b
For IC test only
2
AS8
I/O
Pull-High
CMOS
Input:
Output: Address output to DRAM
For IC test only
3
AS7
I/O
Pull-High
CMOS
Input:
Output: Address output to DRAM
For IC test only
4
AS6
I/O
Pull-High
CMOS
Input:
For IC test only
1: For IC test only
0: Not applicable
Output: Address output to DRAM
5
AS5
I/O
Pull-High
CMOS
Input:
DRAM type selection:
1: 256K b (without external pull-low
resistors)
0: 1Mb (with an external pull-low resistor)
Output: Address output to DRAM
6
AS4
I/O
Pull-High
CMOS
Input:
Manual/Auto playback selection:
1: Manual (without external pull-low
resistors)
0: Auto (with an external pull-low resistor)
Output: Address output to DRAM
7,8
AS3,AS2
I/O
Pull-High
CMOS
Input:
DRAM chip number selection (refer to the
functional description)
Output: Address output to DRAM
9,10
AS1,AS0
I/O
Pull-High
CMOS
Input:
Sampling rate selection (refer to the
functional description)
Output: Address output to DRAM
11
VDD
I
—
Positive power supply
12
AIN
I
—
Pre-amplifier input pin
13
AO
O
—
Pre-amplifier output pin
Amplifier gain should be adjusted between AIN and
AO by a resistor.
14
BIAS
I
—
For internal OP bias de-coupling
15
VOUT
O
—
Audio signal output (non-filtered, output directly)
16
FOUT
O
—
Audio signal output through an internal low-pass
filter
17
VSS
I
—
Negative power supply (GND)
HT8658/HT8659
3
26th Sep ’96