
1
Hologram Unit
HUL7207
Hologram Unit
For optical information processing
Features
Smaller package size achieved through
micro-mirror integration
(4.8
×
8.2
×
4.3 mm)
Fast response (f
C
= 50 MHz)
Focus error signal detection : SSD method
Tracking error signal detection
: 3-beam method
Low-power semiconductor laser included
Unit : mm
0
±
0
L
8.0
(1.8)
+0
11.2
±
0.2
8.2
±
0.2
(0.2)
(0.5)
4
±
0
0
×
5
(
(
X
Y
O
Apparent emitting point
Apparent emitting point
Reference plane
Index mark for No.1
pin on reverse side
Reference plane
Reference plane
Position of
reference plane
4
±
0
4.33
±
0.2
2.55
±
0.2
3
2
±
0
3
±
0
8.1
±
0.2
0
0
±
0
1
±
0
Gate the rest
(Note): 1.Standard corner R=0.20 max.
2.Thickness of plate:Ni 1
μ
m min.+Au 0.1
μ
m min.
3.Thickness of hologram=2.0mm, n=1.519
6
5
4
3
2
1
7
8
9
10
11
12
SEC. X-O-Y
SEC. X-O-Y
7
7
2
2
0
±
0
Applications
CD-ROM drives
(supports 40 time speed CD-ROM drives)
Absolute Maximum Ratings
(Ta = 25C)
Parameter
Symbol
P
O
V
R(LD)
V
R(mon)
V
CC
V
CC
V
C
T
opr
T
stg
Ratings
0.3
2
6
6
+3.0 to +5.5
+1.3 to V
CC
–1.3
–
10 to +60
–
40 to +85
Unit
mW
V
V
V
V
V
C
C
Laser beam output
*1
Laser reverse voltage
Monitor PD reverse voltage
Supply voltage
Operating supply voltage range
Reference voltage
Operating ambient temperature
Storage temperature
*1
Light emitting output through objective lens
Unit Characteristic Specifications
(Tc = 25
±
3C)
Parameter
Laser beam output
*1
Operating current
Operating voltage
Oscillating wavelength
Focus error signal amplitude
Tracking error signal amplitude
Focus error signal pull-in range
Frequency characteristics
Symbol
P
O
I
OP
V
OP
λ
L
V
FE
V
TE
D
FE
f
C
Conditions
min
typ
0.18
35
1.9
795
480
340
12
50
max
0.25
45
2.4
815
620
460
16
Unit
mW
mA
V
nm
mV
mV
μ
m
MHz
V
RF
= 570mV, V
CC
= 5V
CW V
RF
= 570mV, V
CC
= 5V
CW V
RF
= 570mV, V
CC
= 5V
V
RF
= 570mV, V
CC
= 5V
V
RF
= 570mV, V
CC
= 5V
V
RF
= 570mV, V
CC
= 5V
V
RF
= 570mV, V
CC
= 5V
25
775
340
220
9
40
*1
Light emitting output through objective lens