
6
HV254
A113004
Die Size=4800μm X 11180μm (including scribes)
Center of the die is 0,0.
Coordinates for the four corners of the chip (not including scribe):
Notes:
1) The two PGND pads are not electrically connected.
2) The two V
PP
pads, V+ pads, and V- pads are electrically connected.
3) Backside potential is V
PP
. Leave floating or connect to V
PP
.
4) Anode and Cathode are connected to the P and N terminals (respectively) of a silicon diode which can be used to measure
temperature.
)
m
μ
(
X
)
m
μ
(
Y
2
0
4
2
2
9
4
5
2
0
4
2
2
9
4
5
5
3
3
2
2
9
4
5
5
3
3
2
2
9
4
5
Pad Coordinates
e
m
1
3
0
3
9
2
8
2
7
2
6
2
5
2
4
2
3
2
2
2
2
0
2
9
1
8
1
7
1
6
1
5
1
4
1
3
1
2
1
1
0
1
a
N
d
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
H
H
H
a
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
P
)
m
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
μ
(
X
)
m
4
4
5
2
0
6
5
9
2
7
9
3
5
5
6
3
3
3
3
5
2
0
3
0
7
2
5
8
3
2
0
2
5
5
7
1
4
1
5
1
1
1
9
7
5
8
4
6
1
5
5
1
7
4
5
8
7
1
1
2
4
1
7
1
5
0
2
3
2
μ
(
2
Y
e
m
a
N
d
a
H
H
H
H
H
H
H
P
)
m
5
4
5
4
5
4
5
4
5
4
5
4
5
4
7
5
0
9
8
5
3
0
5
9
1
5
5
3
5
5
5
5
1
7
5
7
8
5
3
0
5
5
1
2
5
5
1
2
5
5
1
2
5
5
1
2
5
5
1
2
5
5
1
2
5
5
1
2
5
5
1
2
5
5
1
2
μ
(
X
)
m
5
9
1
0
5
2
3
4
6
3
5
6
9
3
2
4
9
5
4
9
4
9
4
0
5
0
5
0
5
0
5
0
5
0
5
0
5
7
4
4
4
0
4
7
3
4
3
1
3
8
2
5
2
2
2
μ
(
Y
e
m
a
N
d
V
N
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
V
N
I
g
P
a
P
)
m
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1
μ
(
X
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
)
m
9
9
8
7
2
7
5
3
4
9
2
5
1
9
2
1
6
2
9
4
2
1
5
5
1
6
8
1
8
1
2
9
4
2
1
8
2
2
1
3
3
4
3
5
7
3
6
0
4
8
3
4
9
6
4
0
0
5
5
1
3
5
μ
8
5
(
Y
1
1
1
9
6
3
T
U
O
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
5
9
4
V
V
V
V
V
V
V
V
P
V
P
V
V
o
n
A
h
C
V
V
P
V
N
V
N
V
N
V
N
V
N
V
N
V
N
V
N
V
N
T
U
O
6
O
5
O
4
O
3
O
2
O
1
O
0
4
4
4
4
4
4
4
1
1
1
1
1
1
1
2
1
1
1
1
1
1
1
2
6
2
3
3
I
9
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
3
3
n
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
T
U
O
4
T
U
1
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
0
1
d
5
1
T
U
O
9
T
U
T
U
O
4
T
U
6
T
U
O
4
T
U
T
U
O
T
U
1
8
5
5
8
5
8
8
1
8
1
8
1
8
1
8
1
8
1
8
1
5
2
1
1
7
9
3
8
9
6
5
5
1
4
7
2
3
1
T
U
O
9
T
U
T
U
O
P
9
3
7
T
U
O
4
P
7
T
U
O
-
-
d
o
+
+
n
T
U
O
1
9
6
1
5
9
3
7
1
5
9
3
7
1
5
9
T
U
O
e
d
T
U
O
4
3
e
T
U
O
T
U
O
9
T
U
O
d
g
T
U
O
4
I
0
I
1
I
2
I
3
I
4
I
5
I
6
I
7
I
8
T
U
O
T
U
O
1
T
U
O
T
U
O
1
6
0
5
1
4
5
6
7
T
U
O
9
O
8
O
7
O
T
U
V
V
T
U
T
U
Pad Description
V
PP
V+
V-
V
IN
0 to V
IN
31
HV
OUT
0 to HV
OUT
31
PGND
Anode
Cathode
High voltage positive supply. Two V
PP
pads.
Low voltage positive supply. Two V+ pads.
Low voltage negative supply. Two V- pads.
Amplifier inputs.
Amplifier outputs.
Power ground. Two PGND pads. Need to be externally connected together.
Anode side of diode.
Cathode side of diode.
DOC #: DSFP-HV254
A113004