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參數(shù)資料
型號: HYS72V32300GU-8-C2
廠商: INFINEON TECHNOLOGIES AG
英文描述: 3.3 V 32M x 64/72-Bit, 256MByte SDRAM Modules 168-pin Unbuffered DIMM Modules
中文描述: 3.3伏32M的x 64/72-Bit,256MB的內(nèi)存模塊168針腳無緩沖DIMM模塊
文件頁數(shù): 1/16頁
文件大?。?/td> 103K
代理商: HYS72V32300GU-8-C2
INFINEON Technologies
1
9.01
HYS 64/72V32300GU
SDRAM-Modules
3.3 V 32M x 64/72-Bit, 256MByte SDRAM Modules
168-pin Unbuffered DIMM Modules
Description
The HYS 64V32300GU and HYS 72V32300GU are industry standard 168-pin 8-byte Dual in-line
Memory Modules (DIMMs) which are organized as 32M
×
64 and 32M
×
72 in 1 memory bank high
speed memory arrays designed with 256M Synchronous DRAMs (SDRAMs) for non-parity and
ECC applications. The DIMMs use -7 speed sorted 32M
×
8 SDRAM devices in TSOP54 packages
to meet the PC133-222 requirement, -7.5 components for PC133-333 and -8 components for the
standard PC100 applications. Decoupling capacitors are mounted on the PC board. The PC board
design is according to INTEL’s module specification. The DIMMs have a serial presence detect,
implemented with a serial E
2
PROM using the 2-pin I
2
C protocol. The first 128 bytes are utilized by
the DIMM manufacturer and the second 128 bytes are available to the end user. All Infineon 168-
pin DIMMs provide a high performance, flexible 8-byte interface in a 133.35 mm long footprint, with
1.25“ (31.75 mm) height.
168 Pin unbuffered 8 Byte Dual-In-Line
SDRAM Modules for PC main memory
applications using 256Mbit technology.
PC100-222, PC133-333 and PC133-222
versions
One bank 32M
×
64 and 32M
×
72
organisation
Optimized for byte-write non-parity or ECC
applications
Fully PC board layout compatible to INTEL’s
Rev. 1.0 module specification
Programmed Latencies:
Single + 3.3 V (
±
0.3 V) power supply
Programmable CAS Latency, Burst Length,
and Wrap Sequence (Sequential &
Interleave)
Auto Refresh (CBR) and Self Refresh
Decoupling capacitors mounted on substrate
All inputs, outputs are LVTTL compatible
Serial Presence Detect with E
2
PROM
Uses Infineon 256 Mbit SDRAM components
in 32M
×
8 organization and TSOPII-54
packages
Gold contact pads, card size:
133.35 mm
×
31.75 mm
×
3.00 mm
(JEDEC MO-161-BA)
Product Speed
CL
t
RCD
2
t
RP
2
-7
PC133
2
-7.5
PC133
3
3
3
-8
PC100
2
2
2
SDRAM Performance:
-7 / -7.5
-8
Unit
PC133
PC100
f
CK
t
AC
Clock Frequency (max.)
133
100
MHz
Clock Access Time
5.4
6
ns
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