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| 型號： | WS128K32N-35G2TIEA |
| 英文描述： | 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| 中文描述： | 128Kx32 SRAM的多芯片封裝，輻射TOLLERANT |
| 文件頁數(shù)： | 1/6頁 |
| 文件大小： | 334K |
| 代理商： | WS128K32N-35G2TIEA |
1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WS128K32-XG2TXE
December 2000
Rev. 0
ADVANCED*
128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS128K32-XG2TXE – 8 grams typical
Radiation tolerant with epitaxial layer on die.
6T memory cells provide excellent protection
against soft errors
* This product is under development, is not qualified or characterized and is subject to
change or cancellation without notice.
FEATURES
Access Times of 35, 45, 55ns
Packaging
68 lead, 22.4mm CQFP (G2T), 4.57mm (0.180"),
(Package 509)
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
Low Power Data Retention
Commercial, Industrial and Military Temperature
Ranges
5V Power Supply
Low Power CMOS
Pin Description
I/O
0-31
Data Inputs/Outputs
A
0-16
Address Inputs
WE
1-4
#
Write Enables
CS
1-4
#
Chip Selects
OE#
Output Enable
V
CC
Power Supply
GND
Ground
NC
Not Connected
Block Diagram
Top View
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XG2TXE
WE
1
# CS
1
#
CS
2
#
CS
3
#
CS
4
#
WE
4
#
WE
3
#
WE
2
#
128K x 8
128K x 8
128K x 8
128K x 8
OE#
A
0-16
I/O
0-7
I/O
24-31
I/O
16-23
I/O
8-15
8
8
8
8
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
V
C
A
1
A
1
A
1
A
1
A
1
A
1
C
1
#
O
C
2
#
N
W
2
#
W
3
#
W
4
#
N
N
N
N
A
0
A
1
A
2
A
3
A
4
A
5
C
3
#
G
C
4
#
W
1
#
A
6
A
7
A
8
A
9
A
1
V
C
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
The White 68 lead G2T CQFP fills
the same fit and function as the
JEDEC 68 lead CQFJ or 68 PLCC.
But the G2T has the TCE and lead
inspection advantage of the CQFP
form.
相關PDF資料 |
PDF描述 |
|---|---|
| WS128K32N-35G2TME | 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TMEA | 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TQE | 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TQEA | 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-45G2TCE | 128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| WS128K32N-35G2TME | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TMEA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TQE | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TQEA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35H1C | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 5V, 35NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
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