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| 型號： | IDT70V7319S133BF |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | DRAM |
| 英文描述： | Photoelectric Sensor; Sensor Input Type:Optical; Sensing Range Max:50mm; Circuitry:SPDT; Leaded Process Compatible:No; Output Type:PNP; Peak Reflow Compatible (260 C):No; Sensing Mode:Fixed-Field |
| 中文描述： | 256K X 18 DUAL-PORT SRAM, 15 ns, PBGA208 |
| 封裝： | FBGA-208 |
| 文件頁數(shù)： | 1/22頁 |
| 文件大小： | 621K |
| 代理商： | IDT70V7319S133BF |
2002 Integrated Device Technology, Inc.
DECEMBER 2002
DSC 5629/6
1
Functional Block Diagram
Features:
◆
256K x 18 Synchronous Bank-Switchable Dual-ported
SRAMArchitecture
–
64 independent 4K x 18 banks
– 4 megabits of memory on chip
◆
Bank access controlled via bank address pins
◆
High-speed data access
– Commercial: 3.4ns (200MHz)/3.6ns (166MHz)/
4.2ns (133MHz) (max.)
– Industrial: 3.6ns (166MHz)/4.2ns (133MHz) (max.)
◆
Selectable Pipelined or Flow-Through output mode
◆
Counter enable and repeat features
◆
Dual chip enables allow for depth expansion without
additional logic
◆
Full synchronous operation on both ports
– 5ns cycle time, 200MHz operation (14Gbps bandwidth)
– Fast 3.4ns clock to data out
– 1.5ns setup to clock and 0.5ns hold on all control, data, and
address inputs @ 200MHz
– Data input, address, byte enable and control registers
– Self-timed write allows fast cycle time
◆
Separate byte controls for multiplexed bus and bus
matching compatibility
◆
LVTTL- compatible, 3.3V (±150mV) power supply
for core
◆
LVTTL compatible, selectable 3.3V (±150mV) or 2.5V
(±100mV) power supply for I/Os and control signals on
each port
◆
Industrial temperature range (-40°C to +85°C) is
available at 166MHz and 133MHz
◆
Available in a 144-pin Thin Quad Flatpack (TQFP),
208-pin fine pitch Ball Grid Array (fpBGA), and 256-pin Ball
Grid Array (BGA)
◆
Supports JTAG features compliant with IEEE 1149.1
–
D
ue to limted pin count, JTAG is not supported on the
144-pin TQFP package.
HIGH-SPEED 3.3V 256K x 18
SYNCHRONOUS
BANK-SWITCHABLE
DUAL-PORT STATIC RAM
WITH 3.3V OR 2.5V INTERFACE
IDT70V7319S
4Kx18
MEMORY
ARRAY
(BANK 63)
MUX
MUX
PL/
FT
L
OPT
L
CLK
L
ADS
L
CNTEN
L
REPEAT
L
R/
W
L
CE
0L
CE
1L
UB
L
LB
L
OE
L
I/O
0L-17L
A
11L
A
0L
BA
5L
BA
4L
BA
3L
BA
2L
BA
1L
BA
0L
JTAG
4Kx18
MEMORY
ARRAY
(BANK 1)
MUX
MUX
4Kx18
MEMORY
ARRAY
(BANK 0)
MUX
MUX
CONTROL
LOGIC
I/O
CONTROL
BANK
DECODE
ADDRESS
DECODE
I/O
0R-17R
A
11R
A
0R
BA
5R
BA
4R
BA
3R
BA
2R
BA
1R
BA
0R
CONTROL
LOGIC
I/O
CONTROL
BANK
DECODE
ADDRESS
DECODE
5629 drw 01
,
PL/
FT
R
OPT
R
CLK
R
ADS
R
CNTEN
R
REPEAT
R
R/
W
R
CE
0R
CE
1R
UB
R
LB
R
OE
R
TMS
TCK
TRST
TDI
TDO
NOTE:
1. The Bank-Switchable dual-port uses a true SRAM
core instead of the traditional dual-port SRAMcore.
As a result, it has unique operating characteristics.
Please refer to the functional description on page 19
for details.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IDT70V7319S133BFI | HIGH-SPEED 3.3V 256K x 18 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE |
| IDT70V7319S133DD | HIGH-SPEED 3.3V 256K x 18 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE |
| IDT70V7319S133DDI | HIGH-SPEED 3.3V 256K x 18 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE |
| IDT70V7319S200DDI | HIGH-SPEED 3.3V 256K x 18 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE |
| IDT70V7319S166BC | HIGH-SPEED 3.3V 256K x 18 SYNCHRONOUS BANK-SWITCHABLE DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE |
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| IDT70V7319S133BF8 | 功能描述:IC SRAM 4MBIT 133MHZ 208FBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) |
| IDT70V7319S133BFI | 功能描述:IC SRAM 4MBIT 133MHZ 208FBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) |
| IDT70V7319S133BFI8 | 功能描述:IC SRAM 4MBIT 133MHZ 208FBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:8K (1K x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR) |
| IDT70V7319S133DD | 功能描述:IC SRAM 4MBIT 133MHZ 144TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步，DDR II 存儲容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
| IDT70V7319S133DDI | 功能描述:IC SRAM 4MBIT 133MHZ 144TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標(biāo)準(zhǔn)包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步，DDR II 存儲容量:18M（1M x 18） 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA（13x15） 包裝:托盤 其它名稱:71P71804S200BQ |
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