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參數(shù)資料
型號(hào): IDT88P8341BHGI
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 1/96頁(yè)
文件大小: 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
標(biāo)準(zhǔn)包裝: 24
系列: *
其它名稱: 88P8341BHGI
1
2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
DSC-6372/9
APRIL 2006
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc
INDUSTRIAL TEMPERATURE RANGE
IDT88P8341
SPI EXCHANGE SPI-3 TO SPI-4
Issue 1.0
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Functionality
- Low speed to high speed SPI exchange device
- Logical port (LP) mapping (SPI-3 <-> SPI-4) tables per direction
- Per LP configurable memory allocation
- Maskable interrupts for fatal errors
- Fragment and burst length configurable per interface: min 16 bytes,
max 256 bytes
Standard Interfaces
- OIF SPI-3: 8 or 32 bit, 19.44-133 MHz, 256 address range, 64
concurrently active LPs per interface
- One OIF SPI-4 phase 2: 80 - 400 MHz, 256 address range, 64
concurrently active LPs
- SPI-4 FIFO status channel options:
LVDS full-rate
LVTTL eighth-rate
- Compatible with Network Processor Streaming Interface (NPSI)
NPE-Framer mode of operation
- SPI-4 ingress LVDS automatic bit alignment and lane de-skew over
the entire frequency range
- SPI-4 egress LVDS programmable lane pre-skew 0.1 to 0.3 cycle
- IEEE 1149.1 JTAG
- Serial or parallel microprocessor interface for control and monitoring
Full Suite of Performance Monitoring Counters
- Number of packets
- Number of fragments
- Number of errors
- Number of bytes
Green parts available, see ordering information
APPLICATIONS
Ethernet transport
SONET / SDH packet transport line cards
Broadband aggregation
Multi-service switches
IP services equipment
DESCRIPTION
The IDT88P8341 is a SPI (System Packet Interface) Exchange with a SPI-
3interfaceandaSPI-4interface. Thedatathatenteronthelowspeedinterface
(SPI-3)aremappedtologicalidentifiers(LIDs)andenqueuedfortransmission
over the high speed interface (SPI-4). The data that enter on the high speed
interface (SPI-4) are mapped to logical identifiers (LIDs) and enqueued for
transmission over the low speed interface (SPI-3). A data flow between SPI-
3 and SPI-4 interfaces is accomplished with LID maps. The logical port
addresses and number of entries in the LID maps may be dynamically
configured. Various parameters of a data flow may be configured by the user
such as buffer memory size and watermarks. In a typical application, the
IDT88P8341 enables connection of a SPI-3 device to a SPI-4 network
processor. In other applications a SPI-4 device may be connected to a SPI-3
network processor or traffic manager.
6372 drw01
JTAG IF
Control Path
Data Path
Uproc IF
Clock Generator
PFP = Packet Fragment Processor
SPI-3
64 Logical Ports
SPI-4
64 Logical
Ports
SPI-3 to SPI-4 PFP
SPI-4 to SPI-3 PFP
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IDT88P8341BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類(lèi)型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類(lèi)型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA(27x27) 包裝:散裝
IDT88P8342BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類(lèi)型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類(lèi)型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA(27x27) 包裝:散裝
IDT88P8342BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類(lèi)型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類(lèi)型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA(27x27) 包裝:散裝
IDT88P8344 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
IDT88P8344BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類(lèi)型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類(lèi)型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA(27x27) 包裝:散裝
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