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參數資料
| 型號： | IRF1310S |
| 廠商： | International Rectifier |
| 英文描述： | Power MOSFET(Vdss=100V, Rds(on)=0.04ohm, Id=41A) |
| 中文描述： | 功率MOSFET（減振鋼板基本\u003d 100V的，的Rds（on）\u003d 0.04ohm，身份證\u003d 41A條） |
| 文件頁數： | 1/8頁 |
| 文件大小： | 361K |
| 代理商： | IRF1310S |
Parameter
Max.
41
29
160
170
3.8
1.1
0.025
±20
230
41
17
5.5
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation (PCB Mount)**
Linear Derating Factor
Linear Derating Factor (PCB Mount)**
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Soldering Temperature, for 10 seconds
A
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J,
T
STG
V
mJ
A
mJ
V/ns
-55 to + 175
300 (1.6mm from case)
IRF1310S
HEXFET
Power MOSFET
PD - 9.1221
Revision 0
V
DSS
= 100V
R
DS(on)
= 0.04
I
D
= 41A
Advanced Process Technology
Ultra Low On-Resistance
Surface Mount
Available in Tape & Reel
Dynamic dv/dt Rating
Repetitive Avalanche Rated
175°C Operating Temperature
Description
Fourth Generation HEXFETs from International Rectifier utilize advanced
processing techniques to achieve the lowest possible on-resistance per silicon
area. This benefit, combined with the fast switching speed and ruggedized device
design that HEXFET Power MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide variety of applications.
The SMD-220 is a surface mount power package capable of accommodating die
sizes up to HEX-4. It provides the highest power capability and the lowest possible
on-resistance in any existing surface mount package. The SMD-220 is suitable for
high current applications because of its low internal connection resistance and can
dissipate up to 2.0W in a typical surface mount application.
Absolute Maximum Ratings
Thermal Resistance
Parameter
Min.
––––
––––
––––
Typ.
––––
––––
––––
Max.
0.90
40
62
Units
R
θ
JC
R
θ
JA
R
θ
JA
** When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994.
Junction-to-Case
Junction-to-Ambient (PCB Mount)**
Junction-to-Ambient
°C/W
W/°C
W
°C
SMD-220
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