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參數資料
| 型號： | ISD1810 |
| 文件頁數： | 15/18頁 |
| 文件大小： | 464K |
| 代理商： | ISD1810 |
ISD1810 Product
12
Voice Solutions in Silicon
Figure 10: ISD1810 Bonding Physical Layout (Unpackaged Die)
1.
The backside of die is internally connected to V
SS
. It
MUST NOT
be connected to any other potential or damage
may occur.
Die thickness is subject to change, please contact ISD factory for status and availability.
2.
ISD1810
FT
XCLK
VCCD
RECLED
REC VSSD
PLAYE
PLAYL
ROSC
VCCA
SP+
VSSA
SP–
AGC
MICREF
MIC
ISD1810
I.
Die Dimensions
X:2530
Y: 2420
I.
Die Thickness
2
11.5 ± 0.5 mil (typ)
I.
PAD Opening
90 x 90 microns
相關PDF資料 |
PDF描述 |
|---|---|
| ISD1810SERIES | Single-Chip. Single-Message Voice Record/Playback Device |
| ISD25120PRODUCTS | |
| ISD25120S | (1.59 M) |
| ISD2532PRODUCTS | |
| ISD2540PRODUCTS | |
相關代理商/技術參數 |
參數描述 |
|---|---|
| ISD1810P | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Single-Chip, Single-Message Voice Record/Playback Device 8- to 16-Second Durations |
| ISD1810SERIES | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Single-Chip. Single-Message Voice Record/Playback Device |
| ISD1810SY | 功能描述:IC VOICE REC/PLAY 10SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1800 標準包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續時間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應商設備封裝:28-PDIP 其它名稱:90-21300+000 |
| ISD1810X | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Single-Chip, Single-Message Voice Record/Playback Device 8- to 16-Second Durations |
| ISD1810X-H | 制造商:Nuvoton Technology Corp 功能描述:IC VOICE REC/PLAY 10SEC DIE |
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