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參數資料
型號: ISL5861IBZ
廠商: Intersil
文件頁數: 1/13頁
文件大小: 0K
描述: CONV D/A 12-BIT HS 28-SOIC
標準包裝: 26
位數: 12
數據接口: 并聯
轉換器數目: 1
電壓電源: 模擬和數字
功率耗散(最大): 120mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.295",7.50mm 寬)
供應商設備封裝: 28-SOIC W
包裝: 管件
輸出數目和類型: 2 電流,單極
采樣率(每秒): 150M
1
FN6008.2
ISL5861
12-bit, +3.3V, 130/210+MSPS, High Speed
D/A Converter
The ISL5861 is a 12-bit, 130/210+MSPS (Mega Samples
Per Second), CMOS, high speed, low power, D/A (digital to
analog) converter, designed specifically for use in high
performance communication systems such as base
transceiver stations utilizing 2.5G or 3G cellular protocols.
This device complements the ISL5x61 family of high speed
converters, which include 10, 12, and 14-bit devices.
Features
Speed Grades . . . . . . . . . . . . . . . . 130M and 210+MSPS
Low Power . . . . . 103mW with 20mA Output at 130MSPS
Adjustable Full Scale Output Current . . . . . 2mA to 20mA
+3.3V Power Supply
3V LVCMOS Compatible Inputs
Excellent Spurious Free Dynamic Range
(73dBc to Nyquist, fS = 130MSPS, fOUT = 10MHz)
UMTS Adjacent Channel Power =70dB at 19.2MHz
EDGE/GSM SFDR = 90dBc at 11MHz in 20MHz Window
Pin compatible, 3.3V, Lower Power Replacement For The
AD9752 and HI5860
Pb-free available
Applications
Cellular Infrastructure - Single or Multi-Carrier: IS-136,
IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA
BWA Infrastructure
Medical/Test Instrumentation
Wireless Communication Systems
High Resolution Imaging Systems
Arbitrary Waveform Generators
Pinout
ISL5861
TOP VIEW
Ordering Information
PART
NUMBER
TEMP.
RANGE
(oC)
PACKAGE
PKG.
DWG. #
CLOCK
SPEED
ISL5861IB
-40 to 85
28 Ld SOIC
M28.3
130MHz
ISL5861IBZ
(See Note)
-40 to 85
28 Ld SOIC
(Pb-free)
M28.3
130MHz
ISL5861IA
-40 to 85
28 Ld TSSOP M28.173
130MHz
ISL5861IAZ
(See Note)
-40 to 85
28 Ld TSSOP
(Pb-free)
M28.173
130MHz
ISL5861/2IB
-40 to 85
28 Ld SOIC
M28.3
210MHz
ISL5861/2IBZ
(See Note)
-40 to 85
28 Ld SOIC
(Pb-free)
M28.3
210MHz
ISL5861/2IA
-40 to 85
28 Ld TSSOP M28.173
210MHz
ISL5861/2IAZ
(See Note)
-40 to 85
28 Ld TSSOP
(Pb-free)
M28.173
210MHz
ISL5861EVAL1
25
SOIC Evaluation Platform 210MHz
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
28
27
26
25
24
23
22
21
20
19
18
17
16
15
D11 (MSB)
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0 (LSB)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CLK
DCOM
NC
AVDD
COMP
IOUTB
NC
FSADJ
REFIO
REFLO
SLEEP
DVDD
IOUTA
ACOM
DCOM
Data Sheet
August 2004
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
| Intersil and Design is a trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2001, 2004, All Rights Reserved
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