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參數資料
| 型號： | ISP1103 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Universal Serial Bus transceiver |
| 中文描述： | 通用串行總線收發器 |
| 文件頁數： | 13/17頁 |
| 文件大小： | 484K |
| 代理商： | ISP1103 |
Philips Semiconductors
ISP1103
USB transceiver
Preliminary specification
Rev. 01 — 4 October 1999
13 of 17
9397 750 06329
Philips Electronics N.V. 1999. All rights reserved.
12. Soldering
12.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering is not always suitable for surface mount ICs, or for printed-circuit boards
with high population densities. In these situations reflow soldering is often used.
12.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250
°
C. The top-surface
temperature of the packages should preferable be kept below 230
°
C.
12.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
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| ISP1104 | Advanced Universal Serial Bus transceiver |
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| ISP1106 | Advanced Universal Serial Bus transceivers |
相關代理商/技術參數 |
參數描述 |
|---|---|
| ISP1103D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus transceiver |
| ISP1103DB | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus transceiver |
| ISP1103DH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus transceiver |
| ISP1104 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Advanced Universal Serial Bus transceiver |
| ISP1104W | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Advanced Universal Serial Bus transceiver |
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