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參數(shù)資料
| 型號： | ISP1106W |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通用總線功能 |
| 英文描述： | GT 5C 5#16 PIN PLUG |
| 中文描述： | LINE TRANSCEIVER, PBCC16 |
| 封裝： | LEAD AND HALOGEN FREE, 3 X 3 MM, 0.65 MM HEIGHT, PLASTIC, MO-217, SOT-639-2, HBCC-16 |
| 文件頁數(shù)： | 21/24頁 |
| 文件大小： | 588K |
| 代理商： | ISP1106W |
Philips Semiconductors
ISP1105/1106/1107
Advanced USB transceivers
Product data
Rev. 06 — 30 November 2001
21 of 24
9397 750 08872
Koninklijke Philips Electronics N.V. 2001. All rights reserved.
15. Additional soldering information
15.1 (H)BCC packages: footprint
The surface material of the terminals on the resin protrusion consists of a 4-layer
metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1
μ
m min.) ensures
solderability, the Ni layer (5
μ
m min.) prevents diffusion, and the Pd layer on top
(0.5
μ
m min.) ensures effective wire bonding.
15.2 (H)BCC packages: reflow soldering profile
The conditions for reflow soldering of (H)BCC packages are as follows:
Preheating time
: minimum 90 s at T = 145 to 155
°
C
Soldering time
: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183
°
C
Peak temperature
:
–
Ambient temperature: T
amb(max)
= 260
°
C
–
Device surface temperature: T
case(max)
= 255
°
C.
Cavity
: exposed diepad, either functioning as heatsink or as ground connection; only for HBCC packages.
Fig 15. (H)BCC footprint and solder resist mask dimensions.
004aaa123
b1
b
b2
Dh
0.05
All dimensions in mm
For exact dimensions
see package outline
drawing (SOT639-2)
Normal
Terminal
PCB land
Solder resist mask
Stencil mask
Solder land
Corner
0.05
b2
b2
b2
Eh
0.05
0.05
0.05
0.05
0.05
0.1
(4
×
)
0.3 (8
×
)
0.05
Solder resist
Solder stencil
b1
b
Stencil print thickness:
0.1 to 0.12 mm
Cavity
0.05
0.05
Dh
Eh
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1106W,115 | 功能描述:射頻收發(fā)器 USB1.1 LOW VOLTAGE TRANSCEIVER RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1106W,118 | 功能描述:射頻收發(fā)器 USB1.1 LOW VOLTAGE RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1106W-G | 功能描述:射頻收發(fā)器 USB1.1 TRANSCEIVER RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1106W-T | 功能描述:射頻收發(fā)器 USB1.1 LOW VOLTAGE TRANSCEIVER RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1106WTM | 功能描述:IC TXRX SERIAL BUS ADV 16HBCC RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動器，接收器，收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:25 系列:- 類型:收發(fā)器 驅(qū)動器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:4.5 V ~ 5.5 V 安裝類型:通孔 封裝/外殼:16-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:16-PDIP 包裝:管件 |
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