- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄360998 > ISP1122D (NXP SEMICONDUCTORS) Universal Serial Bus stand-alone hub PDF資料下載
參數(shù)資料
| 型號(hào)： | ISP1122D |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | Universal Serial Bus stand-alone hub |
| 中文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PDSO32 |
| 封裝： | PLASTIC, SO-32 |
| 文件頁(yè)數(shù)： | 43/48頁(yè) |
| 文件大小： | 1159K |
| 代理商： | ISP1122D |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)當(dāng)前第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)
Philips Semiconductors
ISP1122
USB stand-alone hub
Product specification
Rev. 03 — 29 March 2000
43 of 48
9397 750 07002
Philips Electronics N.V. 2000. All rights reserved.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
18.2.3
Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
18.3 Through-hole mount packages
18.3.1
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260
°
C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
stg(max)
).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
18.3.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°
C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°
C, contact may be up to 5 seconds.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1122NB | Universal Serial Bus stand-alone hub |
| ISP1123BD | CAP .068UF 100V PPS FILM ECH-S |
| ISP1123 | Universal Serial Bus compound hub |
| ISP1123D | Universal Serial Bus compound hub |
| ISP1123NB | Universal Serial Bus compound hub |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1122NB | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus stand-alone hub |
| ISP1123 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub |
| ISP1123BD | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub |
| ISP1123D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub |
| ISP1123NB | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus compound hub |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。