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參數(shù)資料
型號: K4E641612B
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 4M x 16bit CMOS Dynamic RAM with Extended Data Out
中文描述: 4米× 16位的CMOS動態(tài)隨機存儲器的擴展數(shù)據(jù)輸出
文件頁數(shù): 1/36頁
文件大小: 885K
代理商: K4E641612B
CMOS DRAM
K4E661612B,
K4E641612B
This is a family of 4,194,304 x 16 bit Extended Data Out Mode CMOS DRAMs. Extended Data Out Mode offers high speed random
access of memory cells within the same row. Refresh cycle(4K Ref. or 8K Ref.), access time (-45, -50 or -60), power consumption(Nor-
mal or Low power) are optional features of this family. All of this family have CAS-before-RAS refresh, RAS-only refresh and Hidden
refresh capabilities. Furthermore, Self-refresh operation is available in L-version. This 4Mx16 EDO Mode DRAM family is fabricated
using Samsung
s advanced CMOS process to realize high band-width, low power consumption and high reliability.
Extended Data Out Mode operation
2 CAS Byte/Word Read/Write operation
CAS-before-RAS refresh capability
RAS-only and Hidden refresh capability
Fast parallel test mode capability
Self-refresh capability (L-ver only)
LVTTL(3.3V) compatible inputs and outputs
Early Write or output enable controlled write
JEDEC Standard pinout
Available in Plastic TSOP(II) packages
+3.3V
±
0.3V power supply
Control
Clocks
Lower
Data out
Buffer
RAS
UCAS
LCAS
W
Vcc
Vss
DQ0
to
DQ7
A0~A12
(A0~A11)*1
A0~A8
(A0~A9)*1
Memory Array
4,194,304 x 16
Cells
SAMSUNG ELECTRONICS CO., LTD.
reserves the right to
change products and specifications without notice.
4M x 16bit CMOS Dynamic RAM with Extended Data Out
DESCRIPTION
FUNCTIONAL BLOCK DIAGRAM
Note) *1 : 4K Refresh
S
Upper
Data in
Buffer
Upper
Data out
Buffer
Lower
Data in
Buffer
DQ
8
to
DQ15
OE
Row Decoder
Column Decoder
VBB Generator
Refresh Timer
Refresh Control
Refresh Counter
Row Address Buffer
Col. Address Buffer
Part Identification
- K4E661612B-TC/L(3.3V, 8K Ref., TSOP)
- K4E641612B-TC/L(3.3V, 4K Ref., TSOP)
FEATURES
Refresh Cycles
Part
NO.
Refresh
cycle
Refresh time
Normal
L-ver
K4E661612B*
K4E641612B
8K
4K
64ms
128ms
Unit :
mW
* Access mode & RAS only refresh mode
: 8K cycle/64ms(Normal), 8K cycle/128ms(L-ver.)
CAS-before-RAS & Hidden refresh mode
: 4K cycle/64ms(Normal), 4K cycle/128ms(L-ver.)
Active Power Dissipation
Speed
-45
-50
-60
8K
360
324
288
4K
468
432
396
Performance Range
Speed
-45
-50
-60
t
RAC
50ns
50ns
60ns
t
CAC
12ns
13ns
15ns
t
RC
74ns
84ns
104ns
t
HPC
17ns
20ns
25ns
相關PDF資料
PDF描述
K4E641612B-L 4M x 16bit CMOS Dynamic RAM with Extended Data Out
K4E641612B-TC 4M x 16bit CMOS Dynamic RAM with Extended Data Out
K4E661612B-L 4M x 16bit CMOS Dynamic RAM with Extended Data Out
K4E661612B-TC 4M x 16bit CMOS Dynamic RAM with Extended Data Out
K4E661612B 4M x 16bit CMOS Dynamic RAM with Extended Data Out
相關代理商/技術參數(shù)
參數(shù)描述
K4E641612B-L 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 16bit CMOS Dynamic RAM with Extended Data Out
K4E641612B-TC 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 16bit CMOS Dynamic RAM with Extended Data Out
K4E641612C 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 16bit CMOS Dynamic RAM with Extended Data Out
K4E641612C-45 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 16bit CMOS Dynamic RAM with Extended Data Out
K4E641612C-50 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:4M x 16bit CMOS Dynamic RAM with Extended Data Out
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