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參數(shù)資料
| 型號： | K4S643233H-FE |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | Mobile-SDRAM |
| 中文描述： | 移動SDRAM的 |
| 文件頁數(shù)： | 1/12頁 |
| 文件大小： | 141K |
| 代理商： | K4S643233H-FE |
K4S643233H - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
3.0V & 3.3V power supply.
LVCMOS compatible with multiplexed address.
Four banks operation.
MRS cycle with address key programs.
-. CAS latency (1, 2 & 3).
-. Burst length (1, 2, 4, 8 & Full page).
-. Burst type (Sequential & Interleave).
EMRS cycle with address key programs.
All inputs are sampled at the positive going edge of the system
clock.
Burst read single-bit write operation.
Special Function Support.
-. PASR (Partial Array Self Refresh).
-. Internal TCSR (Temperature Compensated Self Refresh)
DQM for masking.
Auto refresh.
64ms refresh period (4K cycle).
Commercial Temperature Operation (-25
°
C ~ 70
°
C).
Extended Temperature Operation (-25
°
C ~ 85
°
C).
90Balls FBGA with 0.8mm ball pitch
( -FXXX : Leaded, -HXXX : Lead Free).
FEATURES
The K4S643233H is 67,108,864 bits synchronous high data
rate Dynamic RAM organized as 4 x 524,288 words by 32 bits,
fabricated with SAMSUNG’s high performance CMOS technol-
ogy. Synchronous design allows precise cycle control with the
use of system clock and I/O transactions are possible on every
clock cycle. Range of operating frequencies, programmable
burst lengths and programmable latencies allow the same
device to be useful for a variety of high bandwidth and high per-
formance memory system applications.
GENERAL DESCRIPTION
ORDERING INFORMATION
- F(H)E/N/G : Normal / Low / Low Power, Extended Temperature(-25
°
C ~ 85
°
C)
- F(H)C/L/F : Normal / Low / Low Power, Commercial Temperature(-25
°
C ~ 70
°
C)
NOTES :
1. In case of 40MHz Frequency, CL1 can be supported.
2. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific
purpose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.
Part No.
Max Freq.
Interface
Package
K4S643233H-F(H)E/N/G/C/L/F60
166MHz(CL=3)
LVCMOS
90 FBGA
Leaded (Lead Free)
K4S643233H-F(H)E/N/G/C/L/F75
133MHz(CL=3)
K4S643233H-F(H)E/N/G/C/L/F1H
105MHz(CL=2)
K4S643233H-F(H)E/N/G/C/L/F1L
105MHz(CL=3)
*1
512K x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| K4S643233H-FHE | Mobile-SDRAM |
| K4S643233H-G | Mobile-SDRAM |
| K4S643233H-L | Mobile-SDRAM |
| K4S643233H-N | Mobile-SDRAM |
| K4T1G044QA | 1Gb A-die DDR2 SDRAM Specification |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| K4S643233H-FHE | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Mobile-SDRAM |
| K4S643233H-G | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Mobile-SDRAM |
| K4S643233H-HN75000 | 制造商:Samsung Semiconductor 功能描述:DRAM Chip Mobile SDRAM 64M-Bit 2Mx32 3V 90-Pin FBGA |
| K4S643233H-L | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Mobile-SDRAM |
| K4S643233H-N | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Mobile-SDRAM |
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