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參數(shù)資料
| 型號(hào)： | KBJ2C |
| 廠商： | DAESAN ELECTRONICS CORPORATION |
| 英文描述： | CURRENT 4.0 Amperes VOLTAGE 50 to 1000 Volts |
| 中文描述： | 電流四點(diǎn)〇安培電壓50到1000伏特 |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大小： | 100K |
| 代理商： | KBJ2C |
KBJ2A THRU KBJ2M
Features
Mechanical Data
· Glass Passivated Die Construction
· High Case Dielectric Strength
· Low Reverse Leakage Current
·
High surge current capability
· Ideal for Printed Circuit Board Applications
· Plastic Material - UL Flammability Classification 94V-0
Maximum Ratings And Electrical Characteristics
(Ratings at 25
load. For capacitive load, derate by 20%)
ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
CURRENT 4.0 Amperes
VOLTAGE 50 to 1000 Volts
Notes:
(1) Thermal resistance from junction to case per element. Unit mounted on 300 x 300 x 16mm aluminum plate heat sink.
(2) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse voltage
Non-Repetitive Peak Forward Surge Current,
8.3ms single half-sine-wave superimposed
on rated load per element (JEDEC method)
Volts
Forward Voltage (per element) @ I
F
=4.0 A
V
RMM
V
RWM
V
R
50
Volts
Symbols
Units
1.0
V
FM
V
R(RMS)
4.0
3.0
Amps
150
I
FSM
T
j
T
STG
500
-55 to +150
Amps
Peak Reverse Current at Rated
DC Blocking Voltage
Typical Junction Capacitance (Note 1)
Operating and Storage Temperature Range
KBJ
2A
KBJ
2B
KBJ
2C
KBJ
2G
KBJ
2J
KBJ
2K
KBJ
2M
35
5.0
40
100
70
200
140
400
280
600
420
800
560
1000
700
Volts
A
/W
pF
Io
I
RM
C
j
R
JC
@ T
C
=25
@ T
C
=125
Typical Thermal Resistance,
Junction to Case (Note 2)
22
0.125 (3.17)
x 45 degrees
Chamfer
0.080 (2.03)
0.060 (1.50)
0.095 (2.41)
0.080 (2.03)
0.098 (2.5)
0.075 (1.9)
0.825 (20.9)
0.815 (20.7)
0.050 (1.27)
0.040 (1.02)
Polarity shown on front side of case, positive lead beveled corner.
Dimensions in inches and (millimeters)
0.040 (1.02)
0.030 (0.76)
0.022 (0.56)
0.018 (0.46)
0.210
0.190
(5.3)
(4.8)
0.421 (10.7)
0.411 (10.4)
0.718 (18.2)
0.682 (17.3)
0.140 (3.56)
0.128 (3.25)
Lead Depth
0.098 (2.5)
0.075 (1.9)
0.022 (0.56)
0.018 (0.46)
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
High temperature soldering guaranteed:
260
/10 seconds , 0.375" (9.5mm) lead length,
5lbs. (2.3kg) tension
Mounting Position: Any
Weight: 0.071 oz., 2.0 g
Packaging codes/options:
1/400 EA. per Bulk Tray Stack
Maximum average forward @ T
C
=50
R ectified output current at @ T
A
=40
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