- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄367494 > L8576B Dual Ringing SLIC PDF資料下載
參數(shù)資料
| 型號(hào)： | L8576B |
| 英文描述： | Dual Ringing SLIC |
| 中文描述： | 雙振鈴用戶接口 |
| 文件頁(yè)數(shù)： | 21/26頁(yè) |
| 文件大小： | 583K |
| 代理商： | L8576B |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)當(dāng)前第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)
Agere Systems Inc.
21
Data Sheet
May 2001
L8576B Dual Ringing SLIC
Applications
(continued)
ac Design
(continued)
Example 2, Complex Termination
The gain shaping required of a complex termination
impedance can be synthesized using the internal AX
amplifier. The following discussion and equations
present a method for selecting proper component val-
ues for the SLIC/codec interface when using a complex
termination.
Complex termination is usually of the form:
5-6396(F)
To work with this application, convert termination to the
form:
5-6397(F)
where:
R
1
′ = R
1
+ R
2
R
2
′ =
(R
1
+ R
2
)
C′ =
C
For the following discussion, refer to Figure 21.
R
TGP
/R
TGS
/C
TGS
(Z
TG
): These components give gain
shaping to get good gain flatness. These components
are a scaled version of the specified complex termina-
tion impedance. Note for pure (600
) resistive termi-
nations, components R
TGS
and C
TGS
are not used.
Resistor R
TGP
is used and is the series resistance com-
bination of R
GX1
and R
GX2
or 24.4 k
.
R
X
/R
T2
: With other components set, the transmit gain
(for complex and resistive terminations) R
X
and R
T2
are
varied to give specified transmit gain.
R
T1
/R
RCV
/R
GP
: For both complex and resistive termina-
tions, the ratio of these resistors set the receive gain.
For resistive terminations, the ratio of these resistors
set the return loss characteristic. For complex termina-
tions, the ratio of these resistors set the low-frequency
return loss characteristic.
C
N
/R
N1
/R
N2
: For complex terminations, these compo-
nents provide high-frequency compensation to the
return loss characteristic. For resistive terminations,
these components are not used. R
CVN
is connected to
ground via a resistor.
R
HB
: Sets hybrid balance for all terminations.
Set Z
TG
— gain shaping:
Z
TG
= R
TGP
|| R
TGS
+ C
TGS
which is a scaled version of
Z
T/R
(the specified termination resistance) in the
R
1
′ || R
2
′ + C′ form.
R
TGP
must be 24.4 k
to set SLIC transconductance to
125 V/A.
R
TGP
= 24.4 k
At dc, C
TGS
and C′ are open.
R
TGP
= M x R1′
where M is the scale factor.
M =
It can be shown:
R
TGS
= M x R2′
and
C
TGS
=
R
2
C
R
1
R
1
′
C′
R
2
′
1
R
2
-------
+
1
2
---------------------
2
R
1
′
-----------------------
′
M
------
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| L8712(FECONLY) | IC TUBE FOR TO-220 508MM |
| L88R05_SERIES | |
| L8958-11SC | Optoelectronic |
| L8958-12FC | Optoelectronic |
| L8958-12LC | Optoelectronic |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| L8576BP | 制造商:Alcatel-Lucent 功能描述: 制造商:LUCENT 功能描述: |
| L85J250E | 制造商:Ohmite Mfg Co 功能描述: |
| L8601-01 | 制造商:HAMAMATSU 制造商全稱:Hamamatsu Corporation 功能描述:90KV MICROFOCUS X-RAY SOURCE |
| L8605 | 制造商:Leviton Manufacturing Co 功能描述: |
| L8612 | 制造商:Leviton Manufacturing Co 功能描述: |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。