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參數資料
型號: LFX125C-4F900I
廠商: Lattice Semiconductor Corporation
英文描述: The ispXPGA architecture
中文描述: 在ispXPGA架構
文件頁數: 1/89頁
文件大小: 941K
代理商: LFX125C-4F900I
www.latticesemi.com
1
xpga_04
ispXPGA
Family
March 2003
Preliminary Data Sheet
TM
2003 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The speci
fi
cations and information herein are subject to change without notice.
Non-volatile, In
fi
nitely Recon
fi
gurable
Instant-on - Powers up in microseconds via
on-chip E
2
CMOS
based memory
No external con
fi
guration memory
Excellent design security, no bit stream to intercept
Recon
fi
gure SRAM based logic in milliseconds
High Logic Density for System-level
Integration
139K to 1.25M system gates
160 to 496 I/O
1.8V, 2.5V, and 3.3V V
CC
operation
Up to 414Kb sysMEM embedded memory
High Performance Programmable Function
Unit (PFU)
Four LUT-4 per PFU supports wide and narrow
functions
Dual
fl
ip-
fl
ops per LUT-4 for extensive pipelining
Dedicated logic for adders, multipliers, multiplex-
ers, and counters
Variable-Length Interconnect Routing
Technology
Optimum speed, power, and
fl
exibility for logic
interconnections
Flexible Memory Resources
Multiple sysMEM Embedded RAM Blocks
– Single port, Dual port, and FIFO operation
64-bit distributed memory in each PFU
– Single port, Double port, FIFO, and Shift
Register operation
Table 1. ispXPGA Family Selection Guide
Eight sysCLOCK Phase Locked Loops
(PLLs) for Clock Management
True PLL technology
10MHz to 320MHz operation
Clock multiplication and division
Phase adjustment
Shift clocks in 250ps steps
sysIO for High System Performance
High speed memory support through SSTL and
HSTL
Advanced buses supported through PCI, GTL+,
LVDS, BLVDS, and LVPECL
Standard logic supported through LVTTL,
LVCMOS 3.3, 2.5, and 1.8
Programmable drive strength for series termination
Programmable bus maintenance
sysHSI Capability for Ultra Fast Serial
Communications
Up to 850Mbps performance
Up to 20 channels per device
Built in Clock Data Recovery (CDR) and
Serialization and De-serialization (SERDES)
Flexible Programming, Recon
fi
guration,
and Testing
IEEE 1532 and 1149.1 compliant
Microprocessor con
fi
guration interface
Program E
CMOS while operating from SRAM
2
ispXPGA 125
ispXPGA 200
ispXPGA 500
ispXPGA 1200
System Gates
139K
210K
476K
1.25M
PFUs
484
676
1764
3844
LUT-4s
1936
2704
7056
15376
Logic FFs
3.8K
5.4K
14.1K
30.7K
sysMEM Memory
92K
111K
184K
414K
Distributed Memory
30K
43K
112K
246K
EBR
20
24
40
90
sysHSI Channels
4
8
12
20
User I/O
160/176
160/208
336
496
Packaging
256 fpBGA
516 fpBGA
1
256 fpBGA
516 fpBGA
1
516 fpBGA
1
900 fpBGA
680 fpSBGA
900 fpBGA
1
1. Thermally enhanced package.
Note: LFX1200B/C is preliminary, LFX125/200/500B/C information is advanced.
相關PDF資料
PDF描述
LFX200B-3F900I The ispXPGA architecture
LFX1200B-03F900C The ispXPGA architecture
LFX200C-3F900C The ispXPGA architecture
LFX200C-3F900I The ispXPGA architecture
LFX500C-4F900I The ispXPGA architecture
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