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參數資料
型號: LM4863MT
廠商: NATIONAL SEMICONDUCTOR CORP
元件分類: 音頻/視頻放大
英文描述: Dual 2.2W Audio Amplifier Plus Stereo Headphone Function
中文描述: 1.5 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO20
封裝: 4.40 MM, TSSOP-20
文件頁數: 1/16頁
文件大小: 513K
代理商: LM4863MT
LM4863
Dual 2.2W Audio Amplifier Plus Stereo Headphone
Function
General Description
The LM4863 is a dual bridge-connected audio power ampli-
fier which, when connected to a 5V supply, will deliver 2.2W
to a 4
load (Note 1) or 2.5W to a 3
load (Note 2)with less
than 1.0% THD+N. In addition, the headphone input pin al-
lows the amplifiers to operate in single-ended mode to drive
stereo headphones.
Boomer audio power amplifiers were designed specifically to
provide high quality output power from a surface mount
package while requiring few external components. To sim-
plify audio system design, the LM4863 combines dual bridge
speaker amplifiers and stereo headphone amplifiers on one
chip.
The LM4863 features an externally controlled, low-power
consumption shutdown mode, a stereo headphone amplifier
mode, and thermal shutdown protection. It also utilizes cir-
cuitry to reduce “clicks and pops” during device turn-on.
Note 1:
An LM4863MTE which has been properly mounted to the circuit
board will deliver 2.2W into 4
. The other package options for the LM4863
will deliver 1.1W into 8
. See the Application Information section for
LM4863MTE usage information.
Note 2:
An LM4863MTE which has been properly mounted to the circuit
board and forced-air cooled will deliver 2.5W into 3
.
Key Specifications
n
P
O
at 1% THD+N
into 3
(LM4863MTE)
into 4
(LM4863MTE)
into 8
(LM4863)
n
Single-ended mode - THD+N
at 75mW into 32
n
Shutdown current
2.5W(typ)
2.2W(typ)
1.1W(typ)
0.5%(max)
0.7μA(typ)
Features
n
Stereo headphone amplifier mode
n
“Click and pop” suppression circuitry
n
Unity-gain stable
n
Thermal shutdown protection circuitry
n
Exposed-DAP TSSOP, TSSOP, SOIC and DIP
packaging available
Applications
n
Multimedia monitors
n
Portable and desktop computers
n
Portable televisions
Typical Application
Boomer
is a registered trademark of National Semiconductor Corporation.
DS012881-1
*
Refer to the section Proper Selection of External Components, for a detailed discussion of C
B
size.
FIGURE 1. Typical Audio Amplifier Application Circuit
October 1999
L
1999 National Semiconductor Corporation
DS012881
www.national.com
相關PDF資料
PDF描述
LM4863MTE Dual 2.2W Audio Amplifier Plus Stereo Headphone Function
LM4863N Dual 2.2W Audio Amplifier Plus Stereo Headphone Function
LM4864 300 mW Audio Power Amplifier with Shutdown Mode
LM4864M 300 mW Audio Power Amplifier with Shutdown Mode
LM4864MM 300 mW Audio Power Amplifier with Shutdown Mode
相關代理商/技術參數
參數描述
LM4863MT 制造商:Texas Instruments 功能描述:AMP AUDIO DUAL 2.2W 4863 TSSOP20
LM4863MT/NOPB 功能描述:IC AMP AUDIO PWR 3.2W AB 20TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機,2-通道(立體聲) 在某負載時最大輸出功率 x 通道數量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C,麥克風,靜音,短路保護,音量控制 安裝類型:表面貼裝 供應商設備封裝:25-WLP(2.09x2.09) 封裝/外殼:25-WFBGA,WLCSP 包裝:帶卷 (TR)
LM4863MTE 制造商:Texas Instruments 功能描述:Audio Amp Headphone/Speaker 2-CH Stereo 3.2W Class-AB 20-Pin TSSOP EP Rail 制造商:Texas Instruments 功能描述:IC, AUDIO PWR AMP CLASS AB 2.5W TSSOP-16, Amplifier Class:AB, No. of Channels:2, 制造商:Texas Instruments 功能描述:Audio Amplifier Circuit, Dual, 20 Pin, Plastic, TSSOP
LM4863MTE/NOPB 功能描述:IC AMP AUDIO PWR 3.2W AB 20TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機,2-通道(立體聲) 在某負載時最大輸出功率 x 通道數量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C,麥克風,靜音,短路保護,音量控制 安裝類型:表面貼裝 供應商設備封裝:25-WLP(2.09x2.09) 封裝/外殼:25-WFBGA,WLCSP 包裝:帶卷 (TR)
LM4863MTEX/NOPB 功能描述:IC AMP AUDIO PWR 3.2W AB 20TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機,2-通道(立體聲) 在某負載時最大輸出功率 x 通道數量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C,麥克風,靜音,短路保護,音量控制 安裝類型:表面貼裝 供應商設備封裝:25-WLP(2.09x2.09) 封裝/外殼:25-WFBGA,WLCSP 包裝:帶卷 (TR)
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