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參數資料
型號: LM75BD,112
廠商: NXP Semiconductors
文件頁數: 28/37頁
文件大小: 520K
描述: IC TEMP SENSOR DIGITAL 8-SOIC
特色產品: Digital Temperature Sensor / Thermal Watchdog
標準包裝: 100
功能: 溫度監視系統(傳感器),監視器
傳感器類型: 內部
感應溫度: -55°C ~ 125°C
精確度: ±3°C(最小值)
拓撲: ADC(三角積分型),比較器,振蕩器,寄存器庫
輸出類型: 2 線串行,I²C?
輸出警報:
輸出風扇:
電源電壓: 2.8 V ~ 5.5 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 8-SO
包裝: 管件
其它名稱: 935285837112
LM75BD
LM75BD-ND
LM75B
All information provided in this document is subject to legal disclaimers.
?NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 5  22 January 2014
28 of 37
NXP Semiconductors
LM75B
Digital temperature sensor and thermal watchdog
14.4   Reflow soldering
Key characteristics in reflow soldering are:
" Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to 
higher minimum peak temperatures (see Figure 25
) than a SnPb process, thus
reducing the process window
"  Solder paste printing issues including smearing, release, and adjusting the process 
window for a mix of large and small components on one board
"  Reflow temperature profile; this profile includes preheat, reflow (in which the board is 
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 20
 and 21
 
 
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 25
.
Table 20.   SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
?SPAN class="pst LM75BD-112_2300205_10"> 350
< 2.5
235
220
?2.5
220
220
Table 21.   Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
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