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參數資料
| 型號： | LM75BIMX-5+ |
| 廠商： | Maxim Integrated |
| 文件頁數： | 2/12頁 |
| 文件大小： | 701K |
| 描述： | IC TEMP SENSOR WATCHDOG 8SOIC |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 100 |
| 功能： | 溫度監視系統（傳感器），監視器 |
| 傳感器類型： | 內部 |
| 感應溫度： | -55°C ~ 125°C |
| 精確度： | ±3°C（最小值） |
| 拓撲： | ADC（三角積分型），比較器，寄存器庫 |
| 輸出類型： | 2 線串行，I²C? |
| 輸出警報： | 是 |
| 輸出風扇： | 是 |
| 電源電壓： | 3 V ~ 5.5 V |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應商設備封裝： | 8-SOIC |
| 包裝： | 帶卷 (TR) |
Digital Temperature Sensor and Thermal
Watchdog with 2-Wire Interface
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS (Note 1)
ELECTRICAL CHARACTERISTICS
(+V
S
= +3.0V to +5.5V, unless otherwise noted. Temperature accuracy specifications apply for +V
S
= 3.3V for versions with -3 in
the suffix and for +V
S
= 5V for versions with -5 in the suffix. T
A
= -55癈 to +125癈, unless otherwise noted. Typical values are at
+V
S
= +5V, T
A
= +25癈.) (Notes 4, 5)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
+V
S
to GND...........................................................-0.3V to +6.0V
OS, SDA, SCL to GND...........................................-0.3V to +6.0V
All Other Pins to GND.................................-0.3V to (+V
S
+ 0.3V)
Input Current at Any Pin (Note 2)..........................................5mA
Package Input Current (Note 2)..........................................20mA
OS Output Sink Current ......................................................10mA
Continuous Power Dissipation (T
A
= +70癈) (Note 3)
8-Pin 礛AX (礢OP)
(derate 4.5mW/癈 above +70癈)..................................362mW
8-Pin SO (SOP) (derate 5.9mW/癈 above +70癈)........471mW
Junction-to-Case Thermal Resistance (?/DIV>
JC
) (Note 3)
8-Pin 礛AX (礢OP).......................................................42癈/W
8-Pin SO (SOP)..............................................................40癈/W
Junction-to-Ambient Thermal Resistance (?/DIV>
JA
) (Note 3)
8-Pin 礛AX (礢OP).....................................................221癈/W
8-Pin SO (SOP)............................................................170癈/W
ESD Protection
Human Body Model (R
D
= 1.5k? C
S
= 100pF)
All Pins to GND .................................................................?kV
Operating Temperature Range .........................-55癈 to +125癈
Junction Temperature......................................................+150癈
Storage Temperature Range.............................-65癈 to +150癈
Lead Temperature (soldering, 10s).................................+300癈
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
-25癈 d T
A
d +100癈
-2.0
+2.0
Accuracy (Six-Sigma)
-55癈 d T
A
d +125癈
-3.0
+3.0
癈
-25癈 d T
A
d +100癈
-1.5
+1.5
Accuracy (Three-Sigma) (Note 6)
-55癈 d T
A
d +125癈
-2.0
+2.0
癈
Resolution
9
Bits
Temperature Conversion Time
(Note 7)
100
300
ms
I
2
C inactive
0.25
0.5
mA
Shutdown mode, +V
S
= 3V
4
Quiescent Supply Current
Shutdown mode, +V
S
= 5V
6
礎
+V
S
Supply Voltage Range
3.0
5.5
V
OS Output Saturation Voltage
I
OUT
= 4.0mA (Note 8)
0.8
V
OS Delay
(Note 9)
1
6
Conver-
sions
OS Output Fall Time
t
OF
C
L
= 400pF, I
O
= 3mA (Note 10)
250
ns
T
OS
Default Temperature
(Note 11)
80
癈
T
HYST
Default Temperature
(Note 11)
75
癈
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifica-
tions do not apply when operating the device beyond its rated operating conditions.
Note 2: When the input voltage (V
I
) at any pin exceeds the Absolute Maximum Ratings limits (V
I
< GND, V
I
> 6V or V
I
> +V
S
), the
current at that pin should be limited to 5mA. The 20mA maximum package input current rating limits the number of pins that
can safely exceed the power supplies with an input current of 5mA to four.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a single-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
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