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參數資料
| 型號： | LMH6559 |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | High-Speed, Closed-Loop Buffer |
| 中文描述： | 高速，閉環緩沖器 |
| 文件頁數： | 17/22頁 |
| 文件大小： | 1078K |
| 代理商： | LMH6559 |
Application Notes
(Continued)
To minimize peaking due to CL a series resistor for the
purpose of isolation from the output stage should be used. A
low valued resistor will minimize the influence of such a load
capacitor. In a 50
system as is common in high frequency
circuits a 50
series resistor is often used. Usage of the
series resistor, as seen in
Figure 11
eliminates the peaking
but not the dip. The dip will vary with the particular capacitor.
Using a resistor in series with a capacitor creates in a single
pole situation a 6dB/oct rolloff. However, at high frequencies
the internal inductance is appreciable and forms a series LC
combination with the capacitor. Choice of a higher valued
resistor, for example 500 to 1k
, and a capacitor of hun-
dreds of pF’s provides the expected response at lower fre-
quencies.
USING GROUND PLANES
The use of ground planes is recommended both for provid-
ing a low impedance path to ground (or to one of the other
supply voltages) and also for forming effective controlled
impedance transmission lines for the high frequency signal
flow on the board. Multilayer boards often make use of inner
conductive layers for routing supply voltages. These supply
voltage layers form a complete plane rather than using dis-
crete traces to connect the different points together for the
specified supply. Signal traces on the other hand are routed
on outside layers both top and bottom. This allows for easy
access for measurement purposes. Fortunately, only very
high density boards have signal layers in the middle of the
board. In an earlier section, the formula for Z
0
was derived
as:
(6)
The width of a trace is determined by the thickness of the
board. In the case of a multilayer board the thickness is the
space between the trace and the first supply plane under this
trace layer. By common practice, layers do not have to be
evenly divided in the construction of a pcb. Refer to
Figure
12
. The design of a transmission line design over a pcb is
based upon the thickness of the different internal layers and
the
e
r
of the board material. The pcb manufacturer can
supply information about important specifications. For ex-
ample, a nominal 1.6mm thick pcb produces a 50
trace for
a calculated width of 2.9mm. If this layer has a thickness of
0.35mm and for the same
e
, the trace width for 50
should
be of 0.63mm, as calculated from Equation 7, a derivation
from Equation 6.
(7)
Using a trace over a ground plane has big advantages over
the use of a standard single or double sided board. The main
advantage is that the electric field generated by the signal
transported over this trace is fixed between the trace and the
ground plane e.g. there is almost no possibility of radiation
(see
Figure 13
).
20064150
FIGURE 10.
20064151
FIGURE 11.
20064154
FIGURE 12.
L
www.national.com
17
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| LMH6559MFX | High-Speed, Closed-Loop Buffer |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| LMH6559_06 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:High-Speed, Closed-Loop Buffer |
| LMH6559MA | 功能描述:運算放大器 - 運放 RoHS:否 制造商:STMicroelectronics 通道數量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| LMH6559MA/NOPB | 功能描述:運算放大器 - 運放 High-Speed, Closed- Loop Buffer RoHS:否 制造商:STMicroelectronics 通道數量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| LMH6559MAX | 制造商:Texas Instruments 功能描述:OP Amp Single GP 10V 8-Pin SOIC N T/R |
| LMH6559MAX/NOPB | 功能描述:運算放大器 - 運放 RoHS:否 制造商:STMicroelectronics 通道數量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
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