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參數資料
| 型號： | LSP1000 |
| 廠商： | MICROSEMI CORP-LOWELL |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES |
| 中文描述： | 35 V, SILICON, PIN DIODE |
| 文件頁數： | 1/3頁 |
| 文件大小： | 322K |
| 代理商： | LSP1000 |
Microsemi
Microwave Products Division
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 1
Copyright
2000
MSC
1618
.PDF 2000-11-06
W
M
.
C
LSP1000 thru LSP1012
ENHANCED PERFORMANCE
SURFACE MOUNT "EPSM" PACKAGED
DEVICES
PRODUCT PREVIEW
MICROWAVE PRODUCTS DIVISION
DESCRIPTION
Our EPSM packaged devices are designed for the most demanding
commercial and Military requirements where the inconsistency of
performance inherent in plastic surface mount packages cannot be
tolerated. These package styles extend the surface mount construction
format to 6 GHz for high performance wireless applications including
VCO's, limiters, pin switches and pin attenuators. Select PIN diodes for
switching, attenuation or limiting through 6 GHz. They are available in
multiple chip configuration as well as outlines which directly replace SOT-
23 and SOD-323 devices. Other devices and values are always available -
contact our applications engineering department for more details.
IMPORTANT:
For the most current data, consult
MICROSEMI
’s website:
http://www.microsemi.com
PIN DIODE DEVICES
FOR WIRELESS ATTENUATORS,
SWITCHES AND LIMITERS
ABSOLUTE MAXIMUM RATINGS AT 25
°
C
1 Amp (1
μ
s Pulse)
Power Dissipation (P
D
):
500 mW
(Derate to 0 at max T
J
)
Same as V
B
Forward Current (I
F
):
Peak Inverse Volts (PIV):
Junction Temp. (Operating):
Storage Temp. (Non-Operating):
-65
°
C to + 125
°
C
-65
°
C to + 125
°
C
<50 nA @ 80
%
V
B
@ 25
°
C
Leakage:
TEST CONDITIONS:
V
B
@ 10
μ
A
C
T
@ 1 MHz
I
R
= 6 mA
R
S
@ 100 MHz
T
L
@ I
F
= 10 mA
K E Y F E A T U R E S
!"
Frequencies from VHF to 6
GHz
!"
Lower Parasitics
!"
Mil Grade Ceramic/Epoxy
Amalgam Construction
!"
Dense SiO2 Junction
Passivation
!"
Superior
Consistency/Repeatability
!"
Footprints Available for
SOT-23/SOD-323/SOD-123
!"
Priced for Commercial
Products
!"
Tape & Reel for Volume
Pick & Place
!"
High performance wireless
surface mounting including:
!"
GSM
!"
TAGS
!"
WANS
!"
PCS
!"
AMPS
!"
DECT
!"
CELLULAR
A PPL IC AT IONS /BE NE F IT S
L
S
P
1
0
0
0
t
h
r
u
L
S
P
1
0
1
2
TABLE 1
MODEL
VB
C
T
@ V
R
MAX.
RS @ IF
MAX.
2.5
@
5 mA
TL
TYP.
APPLIC
-TION
LSP1000
> 35
.28 @ 5V
80nS
SWITCH
LSP1002
> 100
.32 @
50V
4
@
100 mA
1500nS
ATTENU-
ATOR
LSP1004
> 35
.75 @
20V
0.6
@
10 mA
150nS
SWITCH
LSP1011
> 200V
.35 @
50V
2
@
100 mA
2000nS
ATTENU-
ATOR
LSP1012
> 20V
.35pF @
10V
1.8
@
10 mA
5nS
LIMITER
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PDF描述 |
|---|---|
| LSP1002 | ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES |
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| LSP1000_09 | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:ENHANCED PERFORMANCE SURFACE MOUNT EPSM PIN Diodes TM |
| LSP1002 | 制造商:Microsemi Corporation 功能描述:SURFACE MOUNT PIN DIODES - Bulk |
| LSP1002-454-4 | 制造商:Microsemi Corporation 功能描述: |
| LSP1002-454-4/TR | 制造商:Microsemi Corporation 功能描述: |
| LSP1004 | 制造商:Microsemi Corporation 功能描述:SURFACE MOUNT PIN DIODES - Bulk |
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