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參數資料
| 型號： | LTC3537EUD#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數： | 4/22頁 |
| 文件大小： | 314K |
| 描述： | IC REG DL BST/LINEAR SYNC 16-QFN |
| 標準包裝： | 2,500 |
| 拓撲： | 升壓（升壓）同步（1），線性（LDO）（1） |
| 功能： | 任何功能 |
| 輸出數： | 2 |
| 頻率 - 開關： | 2.2MHz |
| 電壓/電流 - 輸出 1： | 1.5 V ~ 5.25 V，100mA |
| 電壓/電流 - 輸出 2： | 0.6 V ~ 5 V，100mA |
| 帶 LED 驅動器： | 無 |
| 帶監控器： | 無 |
| 帶序列發生器： | 是 |
| 電源電壓： | 0.68 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-WFQFN 裸露焊盤 |
| 供應商設備封裝： | 16-QFN-EP（3x3） |
| 包裝： | 帶卷 (TR) |
LTC3537
4
3537fd
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3537 is guaranteed to meet performance speci cations
from 0癈 to 85癈. Speci cations over the 40癈 to 85癈 operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 3: Speci cation is guaranteed by design and not 100% tested in
production.
ELECTRICAL CHARACTERISTICS
The l denotes the speci cations which apply over the full operating
temperature range, otherwise speci cations are at T
A
= 25癈. (Note 2) V
INL
= 3.3V, V
OLDO
= 3V, unless otherwise noted.
SYMBOL PARAMETER
CONDITIONS
MIN TYP MAX UNITS
PSRR Ripple Rejection
f = 2.2MHz at I
LOAD
= 100mA (Note 3)
24
dB
I
SHORT
Short Circuit Current Limit
V
OLDO
= 0V
l 110 150
mA
V
ENLDOH
ENLDO Input High Voltage
0.8
V
V
ENLDOL
ENLDO Input Low Voltage
0.3
V
I
ENLDO
ENLDO Input Current
V
ENLDO
= 5.5V
1.5
糀
V
PGDLLOW
PGDL Voltage Low
I
PGDL
= 5mA
200
mV
I
PGDLLEAK
PGDL Leakage Current
V
PGDL
= 5.5V
0.01 1
糀
PGDL Trip Point
V
FBL
Rising
96
% V
OLDO
PGDL Hysteresis
3
%
Note 4: Current measurements are made when the output is not switching.
Note 5: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125癈 when overtemperature protection is active.
Continuous operation above the speci ed maximum operating junction
temperature may result in device degradation or failure.
Note 6: Failure to solder the exposed backside of the package to the PC
board ground plane will result in a thermal resistance much higher than
68癈/W.
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