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參數資料
| 型號： | LTC4308CDD#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數： | 1/16頁 |
| 文件大小： | 168K |
| 描述： | IC BUS BUFFER LV 8-DFN |
| 產品培訓模塊： | LTC4310 - Hot-Swappable I²C Isolators |
| 標準包裝： | 2,500 |
| 類型： | 熱交換開關 |
| 應用： | 通用型緩沖器/總線擴展器 |
| 內部開關： | 是 |
| 電源電壓： | 2.3 V ~ 5.5 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WFDFN 裸露焊盤 |
| 供應商設備封裝： | 8-DFN-EP（3x3） |
| 包裝： | 帶卷 (TR) |
LTC4308
1
4308f
Low Voltage, Level Shifting
Hot Swappable 2-Wire Bus
Buffer with Stuck Bus Recovery
The LTC
?/DIV>
4308 hot swappable, 2-wire bus buffer allows
I/O card insertion into a live backplane without corrup-
tion of the data and clock busses. The LTC4308 provides
bidirectional buffering, keeping the backplane and card
capacitances isolated. Negative offset from output to
input allows communication between output bus devices
with high V
OL
and devices on the low voltage input side,
where bus supplies can be as low as 0.9V . If SDAOUT or
SCLOUT are low for 30ms, the LTC4308 will automati-
cally break the Input-Output connection. At this time the
LTC4308 automatically generates up to 16 clock pulses
on SCLOUT in an attempt to free the bus. A connection
will resume if the stuck bus is cleared.
During insertion, the SDAOUT and SCLOUT lines are pre-
charged to 1V to minimize bus disturbances. When driven
high, the ENABLE input allows the LTC4308 to connect after
a stop bit or bus idle condition. Driving ENABLE low breaks
the connection between SDAIN and SDAOUT , SCLIN and
SCLOUT . READY is an open-drain output which indicates
that the backplane and card sides are connected.
n
Live Board Insertion
n
Servers
n
Capacitance Buffer/Bus Extender
n
RAID Systems
n
ATCA
n
Optimized for Low Voltage Systems Down to 0.9V
n
Bidirectional Buffer with Stuck Bus Recovery
n
200mV Offset In-Out/+300mV Offset Out-In
n
30ms Stuck Bus Timeout
n
Compatible with Non-Compliant V
OL
I
2
C Devices
n
Prevents SDA and SCL Corruption During Live
Board Insertion and Removal from Backplane
n
?/SPAN>6kV Human Body Model (HBM) ESD Protection
n
Isolates Input SDA and SCL Lines from Output
n
Compatible with I
2
C", I
2
C Fast Mode and SMBus
n
READY Open-Drain Output
n
1V Precharge on SDAOUT and SCLOUT Lines
n
Small 8-Lead (3mm ?3mm ?0.75mm) DFN and
8-Lead MSOP Packages
1.2V to 5V Level Shifting
The LTC4308 in a 1.2V
Microcontroller Application
TYPICAL APPLICATION
FEATURES
APPLICATIONS
DESCRIPTION
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. Hot Swap
is a trademark of Linear Technology Corporation. All other trademarks are the property of their
respective owners. Protected by U.S. Patents including 7032051, 6650174, 6356140.
V
CC
5V
1.2V
2.7k
LTC4308
SCLIN
SDAIN
SCLOUT
SDAOUT
CARD_SCL
READY
CARD_SDA
READY
GND
ENABLE
2.7k
2.7k
10k
4308 TA01a
2.7k
MICRO-
CONTROLLER
0.01糉
1約/DIV
2V/DIV
CH1
0.5V/DIV
CH2
4308 TA01b
SDAOUT
SDAIN
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相關代理商/技術參數 |
參數描述 |
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| LTC4308CMS8#PBF | 功能描述:IC BUS BUFFER LV 8-MSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:119 系列:- 類型:熱交換控制器 應用:通用型，PCI Express? 內部開關:無 電流限制:- 電源電壓:3.3V，12V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:80-TQFP 供應商設備封裝:80-TQFP（12x12） 包裝:托盤 產品目錄頁面:1423 (CN2011-ZH PDF) |
| LTC4308CMS8#PBF | 制造商:Linear Technology 功能描述:IC HOT SWAP BUS BUFFER MSOP-8 |
| LTC4308CMS8#TRPBF | 功能描述:IC BUS BUFFER LV 8-MSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 標準包裝:50 系列:- 類型:熱交換控制器 應用:-48V 遠程電力系統，AdvancedTCA ? 系統，高可用性 內部開關:無 電流限制:可調 電源電壓:11.5 V ~ 14.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-TFSOP，10-MSOP（0.118"，3.00mm 寬） 供應商設備封裝:10-MSOP 包裝:管件 |
| LTC4308IDD#PBF | 功能描述:IC BUS BUFFER LV 8-DFN RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:119 系列:- 類型:熱交換控制器 應用:通用型，PCI Express? 內部開關:無 電流限制:- 電源電壓:3.3V，12V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:80-TQFP 供應商設備封裝:80-TQFP（12x12） 包裝:托盤 產品目錄頁面:1423 (CN2011-ZH PDF) |
| LTC4308IDD#TRPBF | 功能描述:IC BUS BUFFER LV 8-DFN RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產品培訓模塊:Obsolescence Mitigation Program 標準包裝:100 系列:- 類型:熱插拔開關 應用:通用 內部開關:是 電流限制:可調 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應商設備封裝:10-TDFN-EP（3x3） 包裝:管件 |
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